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0M16V4 BUZ73A IPW60R E332M 31N20D 10020461 03DTN1 R6200230
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  0034.6712 Datasheet PDF File

For 0034.6712 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    CDBV6-00340TI-G

Comchip Technology
Part No. CDBV6-00340TI-G
Description Small Signal Schottky Diodes, V-RRM=40V, V-R=40V, I-O=30mA

File Size 96.79K  /  4 Page

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Renesas Electronics Corporation

Part No. ISL2671286IBZ
Description 12-Bit, 20kSPS SAR ADC
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    FAIRCHILD[Fairchild Semiconductor]
Part No. QRE00034
Description REFLECTIVE OBJECT SENSOR

File Size 186.37K  /  6 Page

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Renesas Electronics Corporation

Part No. ISL26712IRTZ-T7A
Description 12-Bit, 1MSPS SAR ADCs
Tech specs    

Official Product Page

    SIEMENS AG
Part No. C513A-LM C511 C513A-RN C511A-RN C513A-HN C511-RN Q67120-C0989 C513A-2RN C513-1RN C513A-LN Q67120-C1035
Description 8-Bit CMOS Microcontroller 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PQCC44
8-Bit CMOS Microcontroller 8-BIT, 12 MHz, MICROCONTROLLER, PQCC44
High Speed CMOS Logic Triple 3-Input NOR Gates 14-PDIP -55 to 125 8位CMOS微控制器

File Size 699.17K  /  43 Page

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Renesas Electronics Corporation

Part No. ISL2671286IBZ-T
Description 12-Bit, 20kSPS SAR ADC
Tech specs    

Official Product Page

    SAF-C167CR-LM SAB-C167CR-LM SAK-C167CR-LM D167CR C167CR Q67121-C967 Q67121-C942 Q67121-C946

SIEMENS[Siemens Semiconductor Group]
Part No. SAF-C167CR-LM SAB-C167CR-LM SAK-C167CR-LM D167CR C167CR Q67121-C967 Q67121-C942 Q67121-C946
Description From old datasheet system
16-Bit CMOS Single-Chip Microcontroller

File Size 785.80K  /  67 Page

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Renesas Electronics Corporation

Part No. ISL26712IHZ-T7A
Description 12-Bit, 1MSPS SAR ADCs
Tech specs    

Official Product Page

    44067-1202 0440671202

Molex Electronics Ltd.
Part No. 44067-1202 0440671202
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB

File Size 204.16K  /  3 Page

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Renesas Electronics Corporation

Part No. ISL26712IHZ-T
Description 12-Bit, 1MSPS SAR ADCs
Tech specs    

Official Product Page

    BD6712AF BD6712AF11

Rohm
Part No. BD6712AF BD6712AF11
Description Silicon Monolithic Integrated Circuit

File Size 103.51K  /  5 Page

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Renesas Electronics Corporation

Part No. ISL26712IRTZ
Description 12-Bit, 1MSPS SAR ADCs
Tech specs    

Official Product Page

    50856-7125 0508567125

Molex Electronics Ltd.
Part No. 50856-7125 0508567125
Description Ring Tongue Terminal for 10 and 12 AWG, Closed Uninsulated Brazed Barrel, Stud Size M10, Oxygen Free Copper, Length 27.30mm (1.075)
Ring Tongue Terminal for 10 and 12 AWG, Closed Uninsulated Brazed Barrel, Stud Size M10, Oxygen Free Copper, Length 27.30mm (1.075")

File Size 82.36K  /  2 Page

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Renesas Electronics Corporation

Part No. ISL26712IRTZ-T
Description 12-Bit, 1MSPS SAR ADCs
Tech specs    

Official Product Page

    0504467125 50446-7125

Molex Electronics Ltd.
Part No. 0504467125 50446-7125
Description Ring Tongue Double Hole Terminal for 300 - 350MCM AWG, Closed UninsulatedBrazed Barrel, Stud Size M14, Oxygen-Free Copper, Length 111.00mm (4.370")
Ring Tongue Double Hole Terminal for 300 - 350MCM AWG, Closed UninsulatedBrazed Barrel, Stud Size M14, Oxygen-Free Copper, Length 111.00mm (4.370)

File Size 71.29K  /  2 Page

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Amphenol Communications Solutions

Part No. 10137867-1211LF
Description Minitek® Pwr 3.0, Single Row, Right Angle SMT Tails and DIP Board Lock Header, Tin plating, Black Color, 12 Positions, GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    44067-1203 0440671203

Molex Electronics Ltd.
Part No. 44067-1203 0440671203
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selecti

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 10022671-202LF
Description 528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs    

Official Product Page

    44067-1201 0440671201

Molex Electronics Ltd.
Part No. 44067-1201 0440671201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, Tin (Sn) Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, Tin (Sn) Plating

File Size 204.11K  /  3 Page

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Amphenol Communications Solutions

Part No. 10122671-2090LF
Description Mini-SAS HD Cable Assemblies, High Speed Input Output Connectors, 4x to 4x Mini-SAS HD passive internal cable assembly, Short Housing, 12Gbps, Controller to Controller, 30AWG, 0.9meter.
Tech specs    

Official Product Page

For 0034.6712 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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