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  38600-6616 Datasheet PDF File

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    MAX661508 MAX6616AEG

Maxim Integrated Products
Part No. MAX661508 MAX6616AEG
Description Dual-Channel Temperature Monitors and Fan-Speed Controllers with Thermistor Inputs
File Size 183.49K  /  20 Page

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Renesas Electronics Corporation
Part No. HD64338600RXXXFTWV
Description Super Low Power, 16-bit Microcomputers (Non Promotion)
Tech specs 　 　

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HUA FENG CIRCUIT





    R8A66161DD R8A66161DDSP

Renesas Electronics Corporation
Part No. R8A66161DD R8A66161DDSP
Description 16-BIT LED DRIVER WITH SHIFT REGISTER AND LATCH
File Size 680.24K  /  8 Page

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Renesas Electronics Corporation
Part No. HD64338600RXXXFHV
Description Super Low Power, 16-bit Microcomputers (Non Promotion)
Tech specs 　 　

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    M/A-COM Technology Solution...
M/A-COM Technology Solu...
Part No. 2020-6614-20 2020-6616-06 2020-6608-06 2020-6611-30 2020-6615-30 2020-6621-10 2020-6613-10 2020-6628-06 2020-6627-30 2020SERIES
Description Directional Couplers Mini, Octave Bandwidth
   Directional Couplers Mini, Octave Bandwidth
File Size 46.79K  /  2 Page

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Renesas Electronics Corporation
Part No. HD64338600RXXXFHWV
Description Super Low Power, 16-bit Microcomputers (Non Promotion)
Tech specs 　 　

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4F641612C-TC K4F661612C-TC
Description 4M x 16bit CMOS Dynamic RAM with Fast Page Mode
File Size 850.63K  /  35 Page

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Renesas Electronics Corporation
Part No. HD64338600RXXXFTV
Description Super Low Power, 16-bit Microcomputers (Non Promotion)
Tech specs 　 　

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    K4E641612D K4E661612D

Samsung semiconductor
Part No. K4E641612D K4E661612D
Description CMOS DRAM
File Size 395.61K  /  36 Page

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Amphenol Communications Solutions
Part No. 68016-616
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 16 Positions, 2.54 mm (0.100) Pitch.
Tech specs 　 　

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    SAMSUNG[Samsung semiconductor]
Part No. K4F641612E K4F661612E
Description 4M x 16bit CMOS Dynamic RAM with Fast Page Mode
File Size 376.99K  /  35 Page

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Amphenol Communications Solutions
Part No. 131-6616-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs 　 　

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    SAMSUNG[Samsung semiconductor]
Part No. K4F641612D K4F641612D-TI K4F641612D-TP K4F661612D-TP K4F661612D K4F661612D-TI
Description 4M X 16BIT CMOS DYNAMIC RAM WITH FAST PAGE MODE
File Size 380.96K  /  35 Page

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Amphenol Communications Solutions
Part No. 10156616-1100LF
Description Minitek® Board-In, Wire to Board Connectors, Right Angle housing 2.50mm 11 positions
Tech specs 　 　

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4E641612B-TC K4E661612B-TC K4E641612B-L K4E661612B-L
Description 4M x 16bit CMOS Dynamic RAM with Extended Data Out
File Size 891.41K  /  36 Page

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Amphenol Communications Solutions
Part No. 10156616-0800LF
Description Minitek® Board-In, Wire to Board Connectors, Right Angle housing 2.50mm 8 positions
Tech specs 　 　

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4F641612D-TI K4F661612D-TI K4F661612D-TP K4F641612D-TP
Description 4M X 16BIT CMOS DYNAMIC RAM WITH FAST PAGE MODE
File Size 396.62K  /  35 Page

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Amphenol Communications Solutions
Part No. DWRT200PM16616
Description COOLPOWER MEZZANINE
Tech specs 　 　

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4E641611D-TC50 K4E661611D-TC50 K4E641611D-TC60 K4E661611D-TC60
Description 4M x 16bit CMOS Dynamic RAM with Extended Data Out
4M X 16 EDO DRAM, 50 ns, PDSO50
File Size 889.14K  /  36 Page

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Amphenol Communications Solutions
Part No. 131-6616-21D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Right Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

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