| |
|
 |
Molex Electronics Ltd.
|
| Part No. |
0877583650 87758-3650
|
| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
| File Size |
135.77K /
4 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Analog Devices |
| Part No. |
110416-HMC452ST89
|
| Description |
HMC452ST89 Evaluation PCB, 470
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Analog Devices |
| Part No. |
EVAL-CN0416-ARDZ
|
| Description |
Isolated and non-isolated RS-4
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Renesas Electronics Corporation |
| Part No. |
R1LV0416DBG-7LI#S0
|
| Description |
Low Power SRAM, TFBGA, /Embossed Tape
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Renesas Electronics Corporation |
| Part No. |
RMLV0416EGBG-4S2#KC0
|
| Description |
4Mb Advanced LPSRAM (256-kword × 16-bit)
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Renesas Electronics Corporation |
| Part No. |
RMLV0416EGSB-4S2#HA0
|
| Description |
4Mb Advanced LPSRAM (256-kword x 16-bit), TSOP(44), /Embossed Tape
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Renesas Electronics Corporation |
| Part No. |
R1RW0416DSB-0PI#S0
|
| Description |
Wide Temperature Range Version 4M High-speed SRAM (256-kword x 16-bit), TSOP(44), /Embossed Tape
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0877581216 87758-1216
|
| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
| File Size |
170.71K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Renesas Electronics Corporation |
| Part No. |
R1LV0416DSB-7LI#S0
|
| Description |
Low Power SRAM, TSOP(2), /Embossed Tape
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0877581050 87758-1050
|
| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
| File Size |
135.93K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Renesas Electronics Corporation |
| Part No. |
R1LV0416DBG-7LI#B0
|
| Description |
Low Power SRAM, TFBGA, /Tray
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Renesas Electronics Corporation |
| Part No. |
R1LV0416DSB-7LI#B0
|
| Description |
Low Power SRAM, TSOP(2), /Tray
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Renesas Electronics Corporation |
| Part No. |
R1RW0416DSB-0PR#S1
|
| Description |
4M High-speed SRAM (256-kword × 16-bit)
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
