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For assembly-type Found Datasheets File :: 23254    Search Time::2.453ms    
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    SC1409 SC1409ISTR

SEMTECH[Semtech Corporation]
Part No. SC1409 SC1409ISTR
OCR Text ...Evaluation Board Top Copper and Assembly Diagrams 6 (c) 2000 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320 1 A Synchronous Swi...type TPSC476M010R350 or Panasonic Specialty Polymer Aluminum Electrolytic surface mount type ECGC0KB...
Description 1 A Synchronous Switching Regulator

File Size 108.01K  /  8 Page

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    TA32910Q TA32914Q TA329Q TA32912Q

DYNEX[Dynex Semiconductor]
Dynex Semiconductor Ltd.
Part No. TA32910Q TA32914Q TA329Q TA32912Q
OCR Text ...14.0 9/10 TA329..Q POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping...
Description Asymmetric Thyristor

File Size 102.19K  /  10 Page

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    TZA3023 TZA3023T TZA3023U

PHILIPS[Philips Semiconductors]
Part No. TZA3023 TZA3023T TZA3023U
OCR Text ...s particularly important during assembly and handling of the bare die. Additional safety can be obtained by bonding the VCC and GND pads fir...type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds dep...
Description SDH/SONET STM4/OC12 transimpedance amplifier

File Size 191.40K  /  24 Page

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    TZA3043 TZA3043B TZA3043BT TZA3043BU TZA3043T TZA3043U

PHILIPS[Philips Semiconductors]
Part No. TZA3043 TZA3043B TZA3043BT TZA3043BU TZA3043T TZA3043U
OCR Text ...s particularly important during assembly and handling of the bare die. Additional safety can be obtained by bonding the VCC and GND pads fir...type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds dep...
Description Gigabit Ethernet/Fibre Channel transimpedance amplifier

File Size 196.23K  /  28 Page

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    V23833-F0105-B002 V23833-F9105-B002 V23833-FX105-B001 V23833-F9105-B001 V23833-F0105-B001

INFINEON[Infineon Technologies AG]
Part No. V23833-F0105-B002 V23833-F9105-B002 V23833-FX105-B001 V23833-F9105-B001 V23833-F0105-B001
OCR Text ...k Requirement The cage/heatsink assembly required to mount the XFP module is defined by the MSA. Preliminary Product Information 7 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Description Regulatory Compliance Feature ESD: El...
Description XFP1310 nm Small Form Factor Module 10 Gigabit Pluggable Transceiver Compatible with XFP MSA Rev. 3.1

File Size 589.15K  /  25 Page

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    Z89C00

ZILOG[Zilog, Inc.]
Part No. Z89C00
OCR Text ...assembler for the TMS320 family assembly code and a hardware emulator. To assist the user in understanding the Z89C00 DSP Q15 two's compleme...type architecture with separate program and data memory. The design has been optimized for processin...
Description 16-BIT DIGITAL SIGNAL PROCESSOR

File Size 174.60K  /  28 Page

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    CM100DY-28H

POWEREX[Powerex Power Semiconductors]
Part No. CM100DY-28H
OCR Text ...ate, offering simplified system assembly and thermal management. G2 E2 C2E1 E2 C1 E1 G1 Features: Low Drive Power Low VCE(...Type CM Current Rating Amperes 100 VCES Volts (x 50) 28 Outline Drawing and Circuit Diagram Dimen...
Description Dual IGBTMOD 100 Amperes/1400 Volts

File Size 67.61K  /  4 Page

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    CM150DY-28H

Powerex Power Semicondu...
POWEREX[Powerex Power Semiconductors]
Part No. CM150DY-28H
OCR Text ...ate, offering simplified system assembly and thermal management. G2 E2 C2E1 E2 C1 E1 G1 Features: Low Drive Power Low VCE(...Type CM Current Rating Amperes 150 VCES Volts (x 50) 28 Outline Drawing and Circuit Diagram Dimen...
Description Dual IGBTMOD 150 Amperes/1400 Volts

File Size 69.57K  /  4 Page

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    CM200DY-28H

MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric Corporation
Part No. CM200DY-28H
OCR Text ...ate, offering simplified system assembly and thermal management. Features: Low Drive Power Low VCE(sat) Discrete Super-Fast Recovery Free-Wh...Type CM Current Rating Amperes 200 VCES Volts (x 50) 28 G2 E2 C2E1 E2 C1 E1 G1 Out...
Description IGBT Modules:1400V
HIGH POWER SWITCHING USE INSULATED TYPE

File Size 49.59K  /  4 Page

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    CM300DY-28H

MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric Corporation
Part No. CM300DY-28H
OCR Text ...ate, offering simplified system assembly and thermal management. Features: Low Drive Power Low VCE(sat) Discrete Super-Fast Recovery Free-Wh...Type CM Current Rating Amperes 300 VCES Volts (x 50) 28 C2E1 E2 C1 Outline Drawing and C...
Description IGBT Modules:1400V
HIGH POWER SWITCHING USE INSULATED TYPE

File Size 49.35K  /  4 Page

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For assembly-type Found Datasheets File :: 23254    Search Time::2.453ms    
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