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    GENNUM[Gennum Corporation]
Part No. EB9024
OCR Text ...inuous ground plane is provided underneath all high speed traces avoiding impedance discontinuities and ensuring maximum signal integrity - Copper on the power and ground planes has been removed from the area surrounding the center pin of t...
Description GENLINX-TM II EB9024 Evaluation Board

File Size 113.20K  /  9 Page

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    CALMIRCO[California Micro Devices Corp]
Part No. CM3109-00SH CM3109 CM3109-00SB
OCR Text ...a heat spreader attached to the underneath of the PSOP-8 package in order for heat to be transferred much easier from the package to the PCB. The heat spreader is a copper pad of dimensions just smaller than the package itself. By positioni...
Description 2A Sink/Source Regulator for Front Side Bus and DDR Memory Bus Termination

File Size 458.25K  /  12 Page

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    California Micro Devices Corporation
CALMIRCO[California Micro Devices Corp]
Part No. CM3106-12SN CM3106 CM3106-12SB CM3106-12SH CM3106-12SM
OCR Text ...a heat spreader attached to the underneath of the PSOP-8 package in order for heat to be transferred much easier from the package to the PCB. The heat spreader is a copper pad of dimensions just smaller than the package itself. By positioni...
Description 2 Amp Source/ Sink Bus Termination Regulator
2.0A Source/Sink Bus Termination Regulator

File Size 976.72K  /  11 Page

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    WJCI[WJ Communication. Inc.]
Part No. AP502-PCB AP502
OCR Text .... 2. The area around the module underneath the PCB should not contain any soldermask in order to maintain good RF grounding. 3. For proper and safe operation in the laboratory, the power-on sequencing should be followed: a. Connect RF In an...
Description    UMTS-band 4W HBT Amplifier Module

File Size 386.31K  /  5 Page

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    WJCI[WJ Communication. Inc.]
Part No. AP501-PCB AP501
OCR Text .... 2. The area around the module underneath the PCB should not contain any soldermask in order to maintain good RF grounding. 3. For proper and safe operation in the laboratory, the power-on sequencing should be followed: a. Connect RF In an...
Description    PCS-band 4W HBT Amplifier Module

File Size 376.71K  /  5 Page

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    SME1400B-10 SME1400B-10-PCB SME1400B-10F

WJ Communication. Inc.
Part No. SME1400B-10 SME1400B-10-PCB SME1400B-10F
OCR Text ... 2. A minimum of 12 ground vias underneath the device are required. 3. Trace width depends on the PC board material and thickness. LO 8 4 RF 7 6 IIF 5 Pin No. 4 6 8 1, 2, 3, 5, 7 Backside Metal Function RF IF LO GND ...
Description Broadband Surface Mount Mixer

File Size 505.51K  /  5 Page

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    CAT3603HV2 CAT3603HV22 CAT3603HV2T CAT3603

CATALYST[Catalyst Semiconductor]
Part No. CAT3603HV2 CAT3603HV22 CAT3603HV2T CAT3603
OCR Text ...an 200A. TAB is the exposed pad underneath the package. For best thermal performance, the tab should be soldered to the PCB and connected to the ground plane. (c) 2006 Catalyst Semiconductor, Inc. Characteristics subject to change wit...
Description 3-Channel LED Driver in 3x3mm Package

File Size 506.32K  /  12 Page

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    ICS557GI-06LF ICS557GI-06LFT ICS557G-06 ICS557G-06LF ICS557G-06LFT ICS557G-06T ICS557-06

Integrated Device Technology
Part No. ICS557GI-06LF ICS557GI-06LFT ICS557G-06 ICS557G-06LF ICS557G-06LFT ICS557G-06T ICS557-06
OCR Text ...his includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device. Load Resistors RL Since the clock outputs are open source outputs, 50 ohm external resistors to ground are to be ...
Description 1 TO 4 HCSL CLOCK BUFFER

File Size 234.71K  /  11 Page

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