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vias Datasheet PDF File

For vias Found Datasheets File :: 6518 Search Time::1.281ms
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				RF Micro Devices
Part No.	RF1604
OCR Text	...e bottom of the device. thermal vias are required in the pcb layout to effectively conduct heat away from the package. the via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as wel...
Description	BROADBAND HIGH POWER SP4T SWITCH
File Size	516.95K / 9 Page	View it Online	Download Datasheet

				RFMD[RF Micro Devices] RF Micro Devices, Inc.
Part No.	RF2174 RF2174PCBA
OCR Text	...lity that this pin has it's own vias to the groundplane, to minimize any common inductance. Power supply for the pre-amplifier stage and interstage matching. This See pin 3. pin forms the shunt inductance needed for proper tuning of the int...
Description	3V DCS POWER AMPLIFIER 3V DCS POWER AMPLIFIER 3V的集散控制系统功率放大器
File Size	128.76K / 12 Page	View it Online	Download Datasheet

				RF Micro Devices
Part No.	RFPA5201ESB
OCR Text	...ts pin 1 location. 2. thermal vias for center slug ?b? should be incorporated into the pcb design. the number and size of thermal vias will depend on the application example of the number and size of vias can be ...
Description	WiFi Power Amplifier 5.0V, 2.4GHz to 2.5GHz
File Size	232.48K / 7 Page	View it Online	Download Datasheet

				Semtech Corporation
Part No.	SC617ULTRT SC617EVB SC617
OCR Text	...), 4 layer FR4 PCB with thermal vias under the exposed pad per JESD51 standards. Electrical Characteristics Unless otherwise specified: TA = 25C for TYP, -40C to +60C for MIN and MAX; CBUCKET = COUT = 1.0F (ESR < 0.1); CIN = 10.0F; VIN ...
Description	Charge Pump Flash LED Driver with Safety Timer
File Size	206.25K / 13 Page	View it Online	Download Datasheet

				http:// Integrated Device Technology
Part No.	ICS252PMLF ICS252PM ICS252 ICS252M-XX ICS252M-XXLF ICS252M-XXLFT ICS252M-XXT ICS252MI-XX ICS252MI-XXLF ICS252MI-XXLFT ICS252MI-XXT ICS252PMI ICS252PMILF
OCR Text	...g very short PCB traces (and no vias) been the crystal and device. Crystal capacitors must be connected from each of the pins X1 and X2 to ground. The value (in pF) of these crystal caps should equal (CL -6 pF)*2. In this equation, CL= crys...
Description	FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER
File Size	147.76K / 11 Page	View it Online	Download Datasheet

				INTEGRATED DEVICE TECHNOLOGY INC
Part No.	ICS345RP ICS345RPLF ICS345RPLFT ICS345RIPLF ICS345RIPLFT ICS345RIPT ICS345 ICS345R-XX ICS345R-XXLF ICS345R-XXLFT ICS345R-XXT ICS345RI-XX ICS345RI-XXLF ICS345RI-XXLFT 345R-XXLF ICS345RI-XXT ICS345RIP ICS345RPT
OCR Text	...e side of the board, minimizing vias through other signal layers. Decoupling Capacitors As with any high-performance mixed-signal IC, the ICS345 must be isolated from system power supply noise to perform optimally. Decoupling capacitors...
Description	200 MHz, OTHER CLOCK GENERATOR, PDSO20 TRIPLE PLL FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER
File Size	143.21K / 9 Page	View it Online	Download Datasheet

				WJCI[WJ Communication. Inc.]
Part No.	ECG006F-PCB ECG006 ECG006B-G ECG006B-PCB ECG006C-G ECG006C-PCB ECG006F-G
OCR Text	...fig. Notes 1. Ground / thermal vias are critical for the proper performance of this device. vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to...
Description	InGaP HBT Gain Block
File Size	321.34K / 7 Page	View it Online	Download Datasheet

				http:// WJCI[WJ Communication. Inc.]
Part No.	ECG002_07 ECG002 ECG002B-G ECG002B-PCB ECG002C-G ECG002C-PCB ECG002F-G ECG002F-PCB ECG00207
OCR Text	...fig. Notes 1. Ground / thermal vias are critical for the proper performance of this device. vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to...
Description	InGaP HBT Gain Block
File Size	322.89K / 7 Page	View it Online	Download Datasheet

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