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Renesas Electronics Corporation |
| Part No. |
XAH335025.000000K
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| Description |
1000fs Automotive Quartz-based PLL Oscillator
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
5962-93025-000
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| Description |
54FCT2373T
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
XAH335025.000000I
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| Description |
1000fs Automotive Quartz-based PLL Oscillator
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
14-45-1806 A-70475-0425
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| Description |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 6 Circuits
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 6 Circuits
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| File Size |
141.48K /
2 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54112-112402500LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
14-45-1805 70475-0424 A-70475-0424
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| Description |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 5 Circuits
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 5 Circuits
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| File Size |
150.54K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77313-802-50LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 50 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10025026-10202TLF
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| Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x8, 98 Positions, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
14-45-1804 70475-0423 A-70475-0423
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| Description |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 4 Circuits
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 4 Circuits
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| File Size |
150.54K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
61083-102500LF
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| Description |
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 100 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-811102500LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
14-45-1802 A-70475-0421
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| Description |
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 2 Circuits
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 2 Circuits
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| File Size |
150.54K /
3 Page |
View
it Online |
Download Datasheet |
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