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  74026-8231 Datasheet PDF File

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    0014-56-8161 0014-56-8201 0014-56-8121 0014-56-8091 0014-56-8171 0014-56-8081 0014-56-8131 0014-56-8141 0014-56-8191 001

Molex Electronics Ltd.
Part No. 0014-56-8161 0014-56-8201 0014-56-8121 0014-56-8091 0014-56-8171 0014-56-8081 0014-56-8131 0014-56-8141 0014-56-8191 0014-56-8181 0014-56-8251 0014-56-8111 14-56-8231 0014-56-8021 0014-56-8151 001456-8021 14-56-8031 14-56-8041 14-56-8051 14-56-8061 14-56-8071 001456-8201 14-56-8211 14-56-8221 14-56-8241 001456-8251 001456-8131 001456-8141 001456-8081 001456-8111 001456-8181 001456-8091 001456-8121 001456-8171 001456-8151 001456-8191 001456-8161 14568141 14568171 14568251 14568111 14568131 14568151 14568081 14568191 14568181 14568161 14568201 14568091 14568121 0014568131 14-56-8101 0014568031 0014568051 0014568021 0014568061 0014568081 0014568041 0014568042 0014568071 0014568091 0014568151
Description ASSEMBLY, SL CONNECTOR SINGLE ROW 2.54/.100 GRID
   ASSEMBLY, SL CONNECTOR SINGLE ROW 2.54/.100 GRID

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Amphenol Communications Solutions

Part No. 88874-026
Description Quickie®, Wire to Board Connector, Double Row, 26 Positions, 2.54 mm (0.1 in.), Right Angle Header 0.76 um (30 u\\.) Gold Mating Plating
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    RCB1823500KZF RCB1823501KZF RCB1823250KZF RCB1823101KZF RCB1823102KZF RCB1823251KZF RCB1823100MZF RCB1823

Superworld Electronics
Part No. RCB1823500KZF RCB1823501KZF RCB1823250KZF RCB1823101KZF RCB1823102KZF RCB1823251KZF RCB1823100MZF RCB1823
Description    RADIAL CHOKE COIL

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Amphenol Communications Solutions

Part No. 88874-026LF
Description Quickie® IDC Cable-to-Board Connector System, Shrouded Header, Right Angle, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    American Microsemiconductor Inc.
Part No. 1N38211N3821A 1N38221N3822A 1N38231N3823A 1N38241N3824A 1N38251N3825A 1N38271N3827A 1N38281N3828A 1N38261N3826A
Description 1N3821 1N3821A
1N3822 1N3822A
1N3823 1N3823A
1N3824 1N3824A
1N3825 1N3825A
1N3827 1N3827A
1N3828 1N3828A
1N3826 1N3826A

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Amphenol Communications Solutions

Part No. 75374-026LF
Description PV® Wire-to-Board Connector System, Crimp to Wire Receptacle for 0.48mm (0.019in)
Tech specs    

Official Product Page

    0032.1162 0923.2002 0911.0024 0032.1026 0032.1022 0032.1023 0032.1159 0031.1616 0031.2308 7090.6020 7090.6030 0032.1024

Schurter Inc.
Part No. 0032.1162 0923.2002 0911.0024 0032.1026 0032.1022 0032.1023 0032.1159 0031.1616 0031.2308 7090.6020 7090.6030 0032.1024 0032.1120 0031.1185 0031.1161 0031.1165 0031.1001 0031.1091 0031.1095 0031.1081 3101.0031 3101.0020 3101.0015 3101.0035 3101.0010 3101.0030 3101.0036 3101.0025 7170.0930 0750.0141 0751.0056 0751.0062 0751.0099 0751.0100 0751.0141 0750.0142 0032.1147-ND 0031.2320 0031.2323-ND 0031.2321-ND 0031.2322 0031.2320-ND 0031.2322-ND 0031.2220 0859.0041 0859.0042 0859.0046 7149.9019.03 7149.9017.01 0859.0043 0031.2304-ND 0031.2307 0031.2308-ND 0031.2307-ND 0031.2303 0696.0033 0031.3503 0031.3501 7090.5110 7090.5120 0031.3555 0031.3558 7090.5130 0031.3753 0031.3753.01 0031.3751 0031.3751.01 0031.3991 31.1001-ND 31.1028 31.1028-ND 31.1071 31.1071-ND 31.1764-ND 31.1766 31.1766-ND 31.1767 31.1767-ND 31.1769 31.1769-ND 31.1803 31.1803-ND 31.1804 31.1804-ND 31.1809 31.1809-ND 7090.9020.03 3101.0060 32.1005-ND 3101.0055 3101.0050 0031.8211 32.0782 32.0784 32.0784-ND 32.0785 32.0782-ND 32.0785-ND 3101.0110 0032.1015 0032.1018 0032.1013 32.1019-ND 32.1013-ND 0032.1014 0032.1019 32.101-ND 32.1014-ND 0031.3911 0859.0080 0031.3560 0031.3571 0031.3562 0031.3573 0031.3577 0031.5001 0031.5
Description FUSEHOLDERS / SICHERUNGSHALTER

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Amphenol Communications Solutions

Part No. 65823-145LF
Description Quickie Header, Wire to Board Connector, Double Row, 10 Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header 30u\\/0.76um Au/GXT Plating.
Tech specs    

Official Product Page

    P10G5601-F P10G1001-F P10G3301-F P10G2201-F P10G1801-F P40R4745-F P10G5602-F P10R8221-F P10R3921-F P12G1825-F P20G1825-F

Cornell Dubilier Electronics
Cornell Dubilier Electronic...
Cornell Dubilier Electr...
Part No. P10G5601-F P10G1001-F P10G3301-F P10G2201-F P10G1801-F P40R4745-F P10G5602-F P10R8221-F P10R3921-F P12G1825-F P20G1825-F P10R1221-F P10R1821-F P30R4731-F P10R4735-F P10R6821-F P30R8231-F P30G5625-F P10G6815-F P10R4721-F P20R2231-F P20R2731-F P20R1045-F P20R1531-F P20R8235-F P10R1835-F P30G8225-F P40R3945-F
Description Multilayer Ceramic Capacitors
   Multilayer Ceramic Capacitors

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    OX1231A-HZ-10-5.000 OX0130A-HZ-10-5.000 OX0134A-HZ-10-5.000 OX1134A-HZ-10-5.000 OX1234A-HZ-10-5.000 OX0231A-HZ-10-5.000

Assmann Electronics, Inc.
Glenair, Inc.
Panasonic, Corp.
Part No. OX1231A-HZ-10-5.000 OX0130A-HZ-10-5.000 OX0134A-HZ-10-5.000 OX1134A-HZ-10-5.000 OX1234A-HZ-10-5.000 OX0231A-HZ-10-5.000 OX1130A-HZ-10-5.000 OX1136A-HZ-10-5.000 OX0234A-HZ-10-5.000 OX1230A-HZ-10-5.000 OX0131A-HZ-10-5.000 OX0136A-HZ-10-5.000 OX0236A-HZ-10-5.000 OX1236A-HZ-10-5.000 OX2131A-HZ-10-5.000 OX2134A-HZ-10-5.000 OX1131A-HZ-10-5.000 OX2130A-HZ-10-5.000 OX0230A-HZ-10-5.000 OX1234A-HZ-2-5.000 OX3134A-HZ-2-5.000 OX1134A-HZ-2-5.000 OX5234A-HZ-2-5.000 OX8234A-HZ-2-5.000 OX0234A-HZ-2-5.000 OX0134A-HZ-2-5.000 OX6134A-HZ-2-5.000 OX7134A-HZ-2-5.000 OX0134A-HZ-2-50.000 OX2134A-HZ-2-5.000 OX2234A-HZ-2-5.000 OX3234A-HZ-2-5.000 OX6234A-HZ-2-5.000 OX8134A-HZ-2-5.000 OX5134A-HZ-2-5.000 OX7234A-HZ-2-5.000 OX6131A-HZ-10-5.000 OX5231A-HZ-10-5.000 OX0231A-HZ-10-50.000 OX1131A-HZ-10-50.000 OX3131A-HZ-10-5.000 OX7131A-HZ-10-5.000 OX6231A-HZ-10-5.000 OX0131A-HZ-10-50.000 OX5131A-HZ-10-5.000 OX7231A-HZ-10-5.000 OX8131A-HZ-10-5.000 OX8231A-HZ-10-5.000 OX3231A-HZ-10-5.000 OX2231A-HZ-10-5.000 OX0131A-HZ-2-5.000 OX6231A-HZ-2-5.000 OX7231A-HZ-2-5.000 OX0231A-HZ-2-5.000 OX8131A-HZ-2-5.000 OX1131A-HZ-2-5.000 OX5231A-HZ-2-5.000 OX0131A-HZ-2-50.000 OX5131A-HZ-2-5.000 OX3131A-HZ-2-5.000 OX1131A-HZ-2-50.000 OX
Description MCU CMOS 44 LD 4MHZ 4K EPRM, 0C to 70C, 44-PLCC, TUBE
MCU CMOS 44 LD 4MHZ 4K EPRM, -40C to 125C, 44-PLCC, TUBE
MCU CMOS 44 LD 20MHZ 4K EPRM, -40C to 125C, 44-PLCC, TUBE
MCU CMOS 28 LD 10MHZ 8K OTP, 0C to 70C, 28-SOIC 300mil, TUBE
MCU CMOS 44 LD 4MHZ 4K EPRM, -40C to 85C, 44-PLCC, TUBE
MCU CMOS 40 LD 20MHZ 8K OTP, -40C to 85C, 40-PDIP, TUBE
MCU 18LD WITH A/D 20 MHZ, 0C to 70C, 18-PDIP, TUBE
MCU 20LD WITH A/D LOW POWER, 0C to 70C, 20-SSOP 208mil, T/R
MCU CMOS 40 LD 10MHZ 4K EPRM, 0C to 70C, 40-PDIP, TUBE
MCU 20LD WITH A/D 4 MHZ, 0C to 70C, 20-SSOP 208mil, TUBE
MCU CMOS 28 LD 4MHZ 2K EPRM, -40C to 85C, 28-SPDIP, TUBE
MCU CMOS 28 LD 4MHZ 4K EPRM, 0C to 70C, 28-SOIC 300mil, TUBE
MCU 18LD WITH A/D 4MHz, -40C to 125C, 18-PDIP, TUBE
MCU CMOS 28 LD LOW PWR, -40C to 85C, 28-SOIC 300mil, TUBE
MCU 20LD WITH A/D 4 MHZ, -40C to 125C, 20-SSOP 208mil, T/R
MCU 18LD WITH A/D LOW POWER, -40C to 85C, 18-SOIC 300mil, TUBE
MCU CMOS 28 LD 10MHZ 2K EPRM, 0C to 70C, 28-SOIC 300mil, T/R
MCU 20LD WITH A/D 20 MHZ, -40C to 85C, 20-SSOP 208mil, T/R
MCU CMOS 28 LD 4MHZ 2K EPRM, 0C to 70C, 28-SOIC 300mil, T/R
MCU CMOS 28 LD 20MHZ 4K EPRM, -40C to 85C, 28-SOIC 300mil, TUBE
MCU 18LD WITH A/D LOW POWER, 0C to 70C, 18-SOIC 300mil, TUBE
MCU 18LD WITH A/D 20 MHZ, -40C to 85C, 18-PDIP, TUBE
MCU CMOS 28 LD 4MHZ 2K EPRM, -40C to 85C, 28-SSOP 208mil, T/R
MCU CMOS 44 LD 4MHZ 4K EPRM, 0C to 70C, 44-MQFP, TRAY
MCU 18LD WITH A/D LOW POWER, -40C to 85C, 18-PDIP, TUBE
MCU 18LD WITH A/D 4 MHZ, 0C to 70C, 18-SOIC 300mil, TUBE
MCU 18LD WITH A/D LOW POWER, -40C to 125C, 18-PDIP, TUBE
MCU CMOS 44 LD 10MHZ 4K EPRM, 0C to 70C, 44-PLCC, TUBE
MCU 20LD WITH A/D 20MHz, -40C to 85C, 20-SSOP 208mil, T/R
MCU CMOS 28 LD LOW PWR, 0C to 70C, 28-SPDIP, TUBE
MCU 18LD WITH A/D LOW POWER, 0C to 70C, 18-PDIP, TUBE
MCU CMOS 44 LD 20MHZ 4K EPRM, -40C to 85C, 44-MQFP, TRAY
MCU 18LD WITH A/D 20 MHZ, -40C to 85C, 18-SOIC 300mil, TUBE
MCU 20LD WITH A/D 20 MHZ, -40C to 125C, 20-SSOP 208mil, TUBE
MCU CMOS 28 LD 20MHZ 2K EPRM, -40C to 85C, 28-SSOP 208mil, TUBE
MCU CMOS 28 LD 20MHZ 4K EPRM, -40C to 125C, 28-SOIC 300mil, TUBE
MCU 18LD WITH A/D 4 MHZ, -40C to 85C, 18-PDIP, TUBE
MCU CMOS 28 LD 20MHZ 4K EPRM, -40C to 125C, 28-SPDIP, TUBE
MCU CMOS 44 LD 10MHZ 4K EPRM, -40C to 85C, 44-MQFP, TRAY
MCU 18LD WITH A/D 20MHz, 0C to 70C, 18-SOIC 300mil, TUBE
MCU 20LD WITH A/D 4MHz, -40C to 125C, 20-SSOP 208mil, TUBE
MCU 20LD WITH A/D LOW POWER, -40C to 85C, 20-SSOP 208mil, TUBE
MCU 18LD WITH A/D 4 MHZ, 0C to 70C, 18-SOIC 300mil, T/R
MCU 20LD WITH A/D 20 MHZ, -40C to 85C, 20-SSOP 208mil, TUBE
MCU 18LD WITH A/D 20 MHZ, -40C to 125C, 18-SOIC 300mil, TUBE
MCU CMOS 28 LD 10MHZ 8K OTP, -40C to 85C, 28-SOIC 300mil, TUBE
MCU CMOS 44 LD 20MHZ 4K EPRM, 0C to 70C, 44-MQFP, TRAY
MCU CMOS 44 LD 4MHZ 8K OTP, -40C to 85C, 44-MQFP, TRAY
MCU CMOS 44 LD 10MHZ 8K OTP, -40C to 85C, 44-MQFP, TRAY
MCU 20LD WITH A/D LOW POWER, 0C to 70C, 20-SSOP 208mil, TUBE
MCU 18LD WITH A/D 4 MHZ, 0C to 70C, 18-PDIP, TUBE
MCU 18LD WITH A/D 4 MHZ, -40C to 125C, 18-SOIC 300mil, TUBE
MCU 18LD WITH A/D 4 MHZ, -40C to 85C, 18-SOIC 300mil, TUBE
MCU 20LD WITH A/D 20 MHZ, 0C to 70C, 20-SSOP 208mil, TUBE
MCU CMOS 40 LD 20MHZ 8K OTP, 0C to 70C, 40-PDIP, TUBE
MCU CMOS 40 LD 10MHZ 8K OTP, 0C to 70C, 40-PDIP, TUBE
MCU CMOS 40 LD 20MHZ 4K EPRM, 0C to 70C, 40-PDIP, TUBE
MCU CMOS 40 LD 4MHZ 4K EPRM, 0C to 70C, 40-PDIP, TUBE
MCU CMOS 40 LD 4MHZ 8K OTP, 0C to 70C, 40-PDIP, TUBE
MCU 18LD WITH A/D 4MHz, 0C to 70C, 18-SOIC 300mil, TUBE
MCU 18LD WITH A/D 20MHz, 0C to 70C, 18-PDIP, TUBE
MCU CMOS 40 LD 4MHZ 4K EPRM, -40C to 85C, 40-PDIP, TUBE
MCU CMOS 40 LD 10MHZ 4K EPRM, -40C to 85C, 40-PDIP, TUBE
MCU CMOS 44 LD 20MHZ 4K EPRM, -40C to 85C, 44-PLCC, TUBE
MCU CMOS 44 LD 4MHZ 4K EPRM, -40C to 85C, 44-MQFP, TRAY
MCU CMOS 28 LD 20MHZ 8K OTP, -40C to 125C, 28-SPDIP, TUBE
MCU CMOS 44 LD 10MHZ 4K EPRM, -40C to 85C, 44-PLCC, TUBE
MCU 18LD WITH A/D 4 MHZ, -40C to 125C, 18-PDIP, TUBE
MCU 20LD WITH A/D 4 MHZ, -40C to 125C, 20-SSOP 208mil, TUBE
MCU 18LD WITH A/D 20MHz, -40C to 85C, 18-SOIC 300mil, TUBE
MCU 18LD WITH A/D 20MHz, -40C to 125C, 18-PDIP, TUBE
MCU 20LD WITH A/D 20MHz, -40C to 85C, 20-SSOP 208mil, TUBE
MCU 18LD WITH A/D 20MHz, -40C to 85C, 18-PDIP, TUBE
MCU CMOS 28 LD LOW PWR, 0C to 70C, 28-SSOP 208mil, T/R
MCU 18LD WITH A/D 20MHz, 0C to 70C, 18-SOIC 300mil, T/R
MCU CMOS 28 LD 20MHZ 2K EPRM, -40C to 85C, 28-SSOP 208mil, T/R
MCU CMOS 44 LD 4MHZ 4K EPRM, 0C to 70C, 44-TQFP, TRAY 晶体振荡
MCU CMOS 44 LD 20MHZ 4K EPRM, 0C to 70C, 44-PLCC, TUBE 晶体振荡
MCU CMOS 28 LD 4MHZ 8K OTP, 0C to 70C, 28-SOIC 300mil, TUBE 晶体振荡
Crystal Oscillator 晶体振荡
MCU CMOS 28 LD 20MHZ 8K OTP, -40C to 85C, 28-SPDIP, TUBE 晶体振荡

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    NSMX393100TRF NSMX563100TRF NSMX103100TRF NSMX104100TRF NSMX123100TRF NSMX124100TRF NSMX184100TRF NSMX153100TRF NSMX1541

NIC-Components Corp.
Part No. NSMX393100TRF NSMX563100TRF NSMX103100TRF NSMX104100TRF NSMX123100TRF NSMX124100TRF NSMX184100TRF NSMX153100TRF NSMX154100TRF NSMX183100TRF NSMX223100TRF NSMX273100TRF NSMX224100TRF NSMX823100TRF NSMX683100TRF NSMX473100TRF NSMX333100TRF
Description Wound Metalized PPS Film Capacitor Chips

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    EYGA121803PM EYGC182302 EYGC182303 EYGC182307 EYGS182302 EYGS182303 EYGS182307 EYGS182310 EYGS182310XX EYGA091207DM EYGA

Panasonic Semiconductor
Part No. EYGA121803PM EYGC182302 EYGC182303 EYGC182307 EYGS182302 EYGS182303 EYGS182307 EYGS182310 EYGS182310XX EYGA091207DM EYGA121810 EYGA121807DM EYGA121807PA EYGA121807RV EYGA121807V EYGA121807KV EYGA121807A EYGA121807M EYGA121807PM EYGS091210 EYGC091210 EYGM091210 EYGA091210 EYGM091202 EYGM091203 EYGM091207 EYGS121802 EYGS121803 EYGS121807 EYGS121810 EYGA121803DM EYGC121807 EYGC121802 EYGC121803 EYGC121810 EYGA182310 EYGM182310 EYGS091203 EYGS091207 EYGS091202 EYGA121803RV EYGA121802KV EYGA121802M EYGA121802A EYGA121802DM EYGA121802RV EYGA121803A EYGA121803KV EYGM182302 EYGM182307 EYGM182303 EYGA091202 EYGA091202A EYGA091202DM
Description “PGS Graphite Sheets
“PGS?/a> Graphite Sheets
“PGS?Graphite Sheets
   “PGS?Graphite Sheets

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    Renesas Electronics Corporation.
Renesas Electronics, Corp.
Part No. M38230G4-XXXFP M38230G4-XXXHP M38231G4-XXXHP M38232G4-XXXFP M38232G4-XXXHP M38233G4-XXXFP M38233G4-XXXHP M38234G4-XXXFP M38234G4-XXXHP M38235G4-XXXFP M38230G6-XXXFP M38230G6-XXXHP M38231G6-XXXFP M38231G6-XXXHP M38232G6-XXXFP M38232G6-XXXHP M38233G6-XXXFP M38233G6-XXXHP M38234G6-XXXFP M38234G6-XXXHP M38235G6-XXXFP M38235G6-XXXHP M38236G6-XXXHP M38237G6-XXXFP M38237G6-XXXHP M38238G6-XXXFP M38230G7-XXXFP M38230G7-XXXHP M38231G7-XXXFP M38231G7-XXXHP M38232G7-XXXFP M38232G7-XXXHP M38233G7-XXXFP M38233G7-XXXHP M38234G7-XXXFP M38234G7-XXXHP M38235G7-XXXFP M38235G7-XXXHP M38236G7-XXXFP M38236G7-XXXHP M38237G7-XXXFP M38237G7-XXXHP M38238G7-XXXFP M38238G7-XXXHP M38239G7-XXXFP M38239G7-XXXHP M38230G8-XXXFP M38230G8-XXXHP M38231G8-XXXFP M38231G8-XXXHP M38232G8-XXXFP M38232G8-XXXHP M38233G8-XXXFP M38233G8-XXXHP M38234G8-XXXFP M38234G8-XXXHP M38235G8-XXXFP M38235G8-XXXHP M38236G8-XXXFP M38236G8-XXXHP M38237G8-XXXFP M38237G8-XXXHP M38238G8-XXXFP M38238G8-XXXHP M38230GA-XXXFP M38230GA-XXXHP M38231GA-XXXFP M38231GA-XXXHP M38232GA-XXXFP M38232GA-XXXHP M38233GA-XXXFP M38233GA-XXXHP M38234GA-XXXFP M38234GA-XXXHP M38235GA-XXXFP M38235GA-XXXHP M38236GA-XXXFP M38236GA-XXXHP M38237GA-XXXFP M38237GA-XXXHP
Description 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 512Kb x 36; Vcc (V): 3.1 to 3.6 V
36-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 2.4 to 2.6 V
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 3.1 to 3.6 V
18-Mbit (512K x 36/1M x 18) Pipelined SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V
72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V
18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V
36-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2 M x 18/512K x 72) Flow-Through SRAM with NoBL(TM) Architecture; Architecture: NoBL, Flow-through; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 1Mb x 72; Vcc (V): 2.4 to 2.6 V
72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 3.1 to 3.6 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 512Kb x 72; Vcc (V): 3.1 to 3.6 V
72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
Sync SRAM; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 2.4 to 2.6 V
72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 1Mb x 72; Vcc (V): 3.1 to 3.6 V
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V
72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture (2.5 Cycle Read Latency); Architecture: QDR-II , 4 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
72-Mbit DDR-II SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency); Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V 单芯位CMOS微机
72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V 单芯位CMOS微机
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER 单芯位CMOS微机
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 2.4 to 2.6 V 单芯位CMOS微机
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V 单芯位CMOS微机
72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
36-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER 单芯8位CMOS微机
Sync SRAM; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V

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    KEMET[Kemet Corporation]
Part No. C0805C82311RAC C0805C10312RAC C0805C10411RAC C0805C12312RAC C0805C12411RAC C0805C12415RAC C0805C15312RAC C0805C15415RAC C0805C18312RAC C0805C18415RAC C0805C22312RAC C0805C22415RAC C0805C27312RAC C0805C33312RAC C0805C39312RAC C0805C47312RAC C0805C56311RAC C0805C56413RAC C0805C68311RAC C0805C82212RAC
Description Surface Mount Ceramic Chip Capacitors Extended Values 0805, X7R Dielectric, 25, 50, 100, 200 Volts

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