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For 8ka Found Datasheets File :: 131 Search Time::1.578ms
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				Intersil Corporation
Part No.	HI-5700/883
OCR Text	...SIVATION: Type: SiO2 Thickness: 8ka 1kA DIE ATTACH: Material: Gold Silicon Eutectic Alloy Temperature: Ceramic DIP - 460oC (Max) WORST CASE CURRENT DENSITY: 3.05 x 104 A/cm 2 Metallization Mask Layout HI-5700/883 VREF AVDD CLK D5 D6 D...
Description	8-Bit, 20 MSPS Flash A/D Converter
File Size	565.08K / 8 Page	View it Online	Download Datasheet

				Intersil
Part No.	ACS630MS
OCR Text	...SIVATION: Type: SiO2 Thickness: 8ka 1kA WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 110m x 110m 4.4 mils x 4.4 mils Metallization Mask Layout ACS630MS DB2 DB1 DB0 DEF VCC SEF S1 (4) (3) (2) (1) (28) (27) (26) DB3 (5) ...
Description	EDAC, Error Detection and Correction Circuit, Rad-Hard, Advanced Logic, CMOS
File Size	269.58K / 3 Page	View it Online	Download Datasheet

				Intersil, Corp. Intersil Corporation
Part No.	HS1-6664RH/PROTO HS9-6664RH/PROTO HS-6664RH00 5962F9562601QYC 5962F9562601QXC 5962F9562601VYC 5962F9562601VXC HS1-6664RH-Q HS9-6664RH-Q HS1-6664RH-8
OCR Text	...sivation: Type: SiO2 Thickness: 8ka 1kA Top Metallization: M1:6kA 1kA Si/Al/Cu 2kA 500A TiW M2:10kA 2kASi/Al/Cu ASSEMBLY RELATED INFORMATION: Substrate Potential: VDD ADDITIONAL INFORMATION: Worst Case Current Density: 2 x 105 A/cm2 Trans...
Description	8K x 8 CMOS PROM; Temperature Range: -; Package: 28-FlatPack 8K X 8 OTPROM, CDFP28 8K x 8 CMOS PROM; Temperature Range: -; Package: 28-SBDIP 8K X 8 OTPROM, CDIP28 Radiation Hardened 8K x 8 CMOS PROM
File Size	132.94K / 5 Page	View it Online	Download Datasheet

				Intersil
Part No.	HM-6642/883
OCR Text	...SIVATION: Type: SiO2 Thickness: 8ka 1kA WORST CASE CURRENT DENSITY: 1.7 x 105 A/cm2 Metallization Mask Layout HM-6642/883 A4 A5 A6 A7 VCC A8 G1 G2 A3 A2 G3 E P A1 A0 Q0 Q1 Q2 GND Q3 Q4 Q5 Q6 Q7 6 HM-6642/883 Ceramic...
Description	PROM, 512x8 CMOS, high speed, low power, Fast Access Time 120/200ns
File Size	361.81K / 9 Page	View it Online	Download Datasheet

				Intersil Corporation
Part No.	HS-26C31RH-T
OCR Text	...SIVATION: Type: SiO2 Thickness: 8ka 1kA WORST CASE CURRENT DENSITY: < 2.0e5 A/cm2 TRANSISTOR COUNT: 285 PROCESS: Radiation Hardened CMOS, AVLSI Metallization Mask Layout HS-26C31RH (16) VDD (16) VDD (15) DIN (14) DO (13) DO (12) ENABLE...
Description	Radiation Hardened Quad Differential Line Receiver(抗辐射四路差分线接收
File Size	33.14K / 3 Page	View it Online	Download Datasheet

				Intersil, Corp. Intersil Corporation
Part No.	5962F9666302VEC 5962F9666302VXC 5962F9666302V9A HS9-26CLV31RH-8 HS9-26CLV31RH-Q HS1-26CLV31RH/PROTO HS1-26CLV31RH-8 HS0-26CLV31RH-Q HS-26CLV31RH
OCR Text	...horus Silicon Glass) Thickness: 8ka 1kA Metallization: Bottom: Mo/TiW Thickness: 5800A 1kA Top: AlSiCu (Top) Thickness: 10kA 1kA Substrate: AVLSI1RA Backside Finish: Silicon ASSEMBLY RELATED INFORMATION: Substrate Potential (Powered Up):...
Description	Differential Line Driver, Quad, CMOS Enable, 3.3V, Rad-Hard CAP CERAMIC 7PF 50V C0G 0402 QUAD LINE DRIVER, CDFP16 Radiation Hardened 3.3V Quad Differential Line Driver 辐射硬化3.3四路差分线路驱动 Radiation Hardened 3.3V Quad Differential Line Driver QUAD LINE DRIVER, UUC16 Radiation Hardened 3.3V Quad Differential Line Driver QUAD LINE DRIVER, CDIP16 PANEL CAP CERAMIC 6.2PF 50V C0G 0402 CAP CERAMIC 6.8PF 50V C0G 0402
File Size	32.13K / 2 Page	View it Online	Download Datasheet

				Intersil, Corp. Intersil Corporation
Part No.	5962R9563101TEC HS9-26CT32RH 5962R9563101TXC HS1-26CT32RH
OCR Text	...SIVATION: Type: SiO2 Thickness: 8ka 1kA WORST CASE CURRENT DENSITY: < 2.0e5 A/cm2 TRANSISTOR COUNT: 315 PROCESS: Radiation Hardened CMOS, AVLSI Metallization Mask Layout HS-26CT32RH-T AIN (1) VDD (16) BIN (15) AIN (2) (14) BIN ...
Description	Radiation Hardened Quad Differential Line Receiver QUAD LINE RECEIVER, CDIP16
File Size	43.62K / 3 Page	View it Online	Download Datasheet

				Intersil, Corp. Intersil Corporation
Part No.	5962R9563201TXC HS-26CT31RH-T HS9-26C31RH-T 5962R9563201TEC HS1-26CT31RH-T
OCR Text	...SIVATION: Type: SiO2 Thickness: 8ka 1kA WORST CASE CURRENT DENSITY: < 2.0e5 A/cm2 TRANSISTOR COUNT: 285 PROCESS: Radiation Hardened CMOS, AVLSI Metallization Mask Layout HS-26CT31RH (16) VDD (16) VDD (15) DIN (14) DO (13) DO (12) ENABL...
Description	Radiation Hardened Quad Differential Line Driver(抗辐射四路差分线驱动辐射加固四路差分线路驱动器（抗辐射四路差分线驱动器）
File Size	33.17K / 3 Page	View it Online	Download Datasheet

				Intersil
Part No.	HS-26CLV32RH
OCR Text	...horus Silicon Glass) Thickness: 8ka 1kA Substrate: AVLSI1RA, Silicon backside, VDD backside potential Metallization: Bottom: Mo/Tiw Thickness: 5800A 1kA Top: Al/Si/Cu Thickness: 10kA 1kA Worst Case Current Density: <2.0 x 105A/cm2 Bond Pad...
Description	Differential Line Receiver, Quad, CMOS Enable, 3.3V, Rad-Hard
File Size	64.42K / 3 Page	View it Online	Download Datasheet

				Intersil
Part No.	HS-26CT32RH-T
OCR Text	...SIVATION: Type: SiO2 Thickness: 8ka 1kA WORST CASE CURRENT DENSITY: < 2.0e5 A/cm 2 TRANSISTOR COUNT: 315 PROCESS: Radiation Hardened CMOS, AVLSI Metallization Mask Layout HS-26CT32RH-T AIN (1) VDD (16) BIN (15) AIN (2) (14) BIN ...
Description	Differential Line Receiver, Quad, TTL Enable, 5V, Rad-Hard
File Size	61.29K / 3 Page	View it Online	Download Datasheet

For 8ka Found Datasheets File :: 131 Search Time::1.578ms
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