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Maxim Integrated Products, Inc.
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Part No. |
MAX1304
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Description |
8-/4-/2-Channel. 12-Bit. Simultaneous-Sampling ADCs with 0V. V. and 0 to 5V Analog Input Ranges
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File Size |
584.04K /
36 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
130-4182-11H
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Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Daughtercard Module, APP.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
130-4142-11H
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Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Daughtercard Module, APP.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
130-4182-11D
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Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Daughtercard Module, Nickel Sulfamate.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
130-4142-15D
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Description |
Paladin Plus 4-Pair, 4 Column, Right Angle Receptacle, Signal Module, NiS
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
130-4182-15H
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Description |
Paladin Plus 4-Pair, 8 Column, Right Angle Receptacle, Signal Module, APP
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
130-4162-15D
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Description |
Paladin Plus 4-Pair, 6 Column, Right Angle Receptacle, Signal Module, NiS
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
130-4142-11D
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Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Daughtercard Module, Nickel Sulfamate.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
90136-1130 0901361130
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Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 30 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni) 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 30 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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File Size |
159.24K /
4 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
130-4142-15H
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Description |
Paladin Plus 4-Pair, 4 Column, Right Angle Receptacle, Signal Module, APP
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
90136-1112 0901361112
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Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 12 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni) 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 12 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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File Size |
159.24K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
130-4162-11H
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Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Daughtercard Module, APP.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
90136-1118 0901361118
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Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 18 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni) 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 18 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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File Size |
159.24K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
130-4182-15D
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Description |
Paladin Plus 4-Pair, 8 Column, Right Angle Receptacle, Signal Module, NiS
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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