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Motorola
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Part No. |
MPX2201 MPX2200AP
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OCR Text |
...ifferential
SILICONE GEL DIE coat WIRE BOND
WIRE BOND
LEAD FRAME
DIFFERENTIAL/GAUGE ELEMENT P2
DIE BOND
LEAD FRAME
Figure 4. Cross-Sectional Diagrams (Not to Scale)
Figure 4 illustrates an absolute sensing die (right... |
Description |
200 kPa on-Chip Temperature Compensated & Calibrated Pressure Sensors From old datasheet system
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File Size |
158.03K /
8 Page |
View
it Online |
Download Datasheet
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Motorola Semiconductor Products Inc
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Part No. |
MPX5700 MPX5700AS MPX5700AP
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OCR Text |
...erential
FLUORO SILICONE DIE coat DIE P1 WIRE BOND
STAINLESS STEEL METAL COVER
+5 V
Vout Vs IPS 1.0 mF 0.01 mF GND 470 pF OUTPUT
LEAD FRAME
Motorola Sensor Device Data
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P2 E... |
Description |
From old datasheet system Signal Conditioner, Other - Datasheet Reference INTEGRATED PRESSURE SENSOR 0 to 700 kPa (0 to 101.5 psi) 0.2 to 4.7 V OUTPUT
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File Size |
118.25K /
7 Page |
View
it Online |
Download Datasheet
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Price and Availability
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