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				BOURNS[Bourns Electronic Solutions]
Part No.	2DAB-F6RLF 2DAB-F6R
OCR Text	...s a silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The gri...
Description	Integrated Passive & Active Device
File Size	222.58K / 4 Page	View it Online	Download Datasheet

				Bourns Electronic Solutions
Part No.	2DAC-C16R 2DAC-C16RLF
OCR Text	...s a Silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the Silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The gri...
Description	Integrated Passive & Active Device using CSP
File Size	232.59K / 4 Page	View it Online	Download Datasheet

				BOURNS[Bourns Electronic Solutions]
Part No.	2DAD-C5RLF 2DAD-C5R
OCR Text	...s a silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The gri...
Description	Integrated Passive & Active Device using CSP
File Size	213.15K / 4 Page	View it Online	Download Datasheet

				Bourns Electronic Solutions Bourns, Inc.
Part No.	2FAB-M20R
OCR Text	...ns This silicon-based device is packaged using micro leadframe packaging technology. The MLPs have an exposed die attach pad that provides the interconnect medium from die to PCB. The pads are arranged for easy PCB routing. The pitch is 0.5...
Description	Integrated Passive & Active Device using MLP
File Size	290.45K / 4 Page	View it Online	Download Datasheet

				Bourns, Inc. BOURNS[Bourns Electronic Solutions]
Part No.	2FAD-C20R 2FAD-C20RLF
OCR Text	...s a Silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the Silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The gri...
Description	Integrated Passive & Active Device using CSP
File Size	240.05K / 4 Page	View it Online	Download Datasheet

				BOURNS[Bourns Electronic Solutions] Bourns, Inc.
Part No.	2FAE-C15R 2FAE-C15RLF
OCR Text	...s a silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The gri...
Description	Integrated Passive & Active Device using CSP
File Size	219.15K / 4 Page	View it Online	Download Datasheet

				Bourns, Inc. BOURNS[Bourns Electronic Solutions]
Part No.	2FAG-C15RLF 2FAG-C15R
OCR Text	...s a Silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the Silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The gri...
Description	Integrated Passive & Active Device using CSP
File Size	241.38K / 4 Page	View it Online	Download Datasheet

				Bourns, Inc. BOURNS[Bourns Electronic Solutions]
Part No.	2FAK-C15R 2FAK-C15RLF
OCR Text	...s a silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The gri...
Description	Integrated Passive & Active Device using CSP
File Size	218.89K / 4 Page	View it Online	Download Datasheet

				Bourns, Inc. BOURNS[Bourns Electronic Solutions]
Part No.	2FAM-C5RLF 2FAM-C5R
OCR Text	...s a silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The gri...
Description	Integrated Passive & Active Device using CSP
File Size	235.85K / 4 Page	View it Online	Download Datasheet

For packaged Found Datasheets File :: 29243 Search Time::4.407ms
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