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SSM2211S 003900 FBR2030 2SJ254 D1803 AM3407PE AAA900 XQV300
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For packaged Found Datasheets File :: 29243    Search Time::4.407ms    
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    BOURNS[Bourns Electronic Solutions]
Part No. 2DAB-F6RLF 2DAB-F6R
OCR Text ...s a silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The gri...
Description Integrated Passive & Active Device
File Size 222.58K  /  4 Page

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    2DAC-C16R 2DAC-C16RLF

Bourns Electronic Solutions
Part No. 2DAC-C16R 2DAC-C16RLF
OCR Text ...s a Silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the Silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The gri...
Description Integrated Passive & Active Device using CSP
File Size 232.59K  /  4 Page

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    2DAD-C5RLF 2DAD-C5R

BOURNS[Bourns Electronic Solutions]
Part No. 2DAD-C5RLF 2DAD-C5R
OCR Text ...s a silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The gri...
Description Integrated Passive & Active Device using CSP
File Size 213.15K  /  4 Page

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    2FAB-M20R

Bourns Electronic Solutions
Bourns, Inc.
Part No. 2FAB-M20R
OCR Text ...ns This silicon-based device is packaged using micro leadframe packaging technology. The MLPs have an exposed die attach pad that provides the interconnect medium from die to PCB. The pads are arranged for easy PCB routing. The pitch is 0.5...
Description Integrated Passive & Active Device using MLP
File Size 290.45K  /  4 Page

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    2FAD-C20R 2FAD-C20RLF

Bourns, Inc.
BOURNS[Bourns Electronic Solutions]
Part No. 2FAD-C20R 2FAD-C20RLF
OCR Text ...s a Silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the Silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The gri...
Description Integrated Passive & Active Device using CSP
File Size 240.05K  /  4 Page

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    2FAE-C15R 2FAE-C15RLF

BOURNS[Bourns Electronic Solutions]
Bourns, Inc.
Part No. 2FAE-C15R 2FAE-C15RLF
OCR Text ...s a silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The gri...
Description Integrated Passive & Active Device using CSP
File Size 219.15K  /  4 Page

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    2FAG-C15RLF 2FAG-C15R

Bourns, Inc.
BOURNS[Bourns Electronic Solutions]
Part No. 2FAG-C15RLF 2FAG-C15R
OCR Text ...s a Silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the Silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The gri...
Description Integrated Passive & Active Device using CSP
File Size 241.38K  /  4 Page

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    2FAK-C15R 2FAK-C15RLF

Bourns, Inc.
BOURNS[Bourns Electronic Solutions]
Part No. 2FAK-C15R 2FAK-C15RLF
OCR Text ...s a silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The gri...
Description Integrated Passive & Active Device using CSP
File Size 218.89K  /  4 Page

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    2FAM-C5RLF 2FAM-C5R

Bourns, Inc.
BOURNS[Bourns Electronic Solutions]
Part No. 2FAM-C5RLF 2FAM-C5R
OCR Text ...s a silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The gri...
Description Integrated Passive & Active Device using CSP
File Size 235.85K  /  4 Page

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Price and Availability
 
Price & Availability of packaged
Newark

Part # Manufacturer Description Price BuyNow  Qty.
0986 EMC 501 (PACKAGED 25 PER
12X2581		 Lumberg Automation 0986 Emc 501 (Pkg Of 25)/ Color, Match Request |Lumberg Automation 0986 EMC 501 (PACKAGED 25 PER 10: USD243.57
5: USD252.27
1: USD262.42
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0
0986 EMC 500 (PACKAGED 25 PER
12X2580		 Lumberg Automation 0986 Emc 500 (Pkg Of 25) |Lumberg Automation 0986 EMC 500 (PACKAGED 25 PER 10: USD241.21
5: USD249.83
1: USD259.88
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0

DigiKey

Part # Manufacturer Description Price BuyNow  Qty.
830M1-0500-TRAY-PACKAGED
223-830M1-0500-TRAY-PACKAGED-ND		 TE Connectivity TRIAXIAL, 500G, TRAY 25: USD140.17
10: USD145.176
1: USD160.19
 BuyNow
49
830M1-0200-TRAY-PACKAGED
223-830M1-0200-TRAY-PACKAGED-ND		 TE Connectivity TRIAXIAL, 200G, TRAY 25: USD140.17
10: USD145.176
1: USD160.19
 BuyNow
48
830M1-1000-TRAY-PACKAGED
223-830M1-1000-TRAY-PACKAGED-ND		 TE Connectivity TRIAXIAL, 1000G, TRAY 25: USD140.17
10: USD145.176
1: USD160.19
 BuyNow
47
830M1-2000-TRAY-PACKAGED
223-830M1-2000-TRAY-PACKAGED-ND		 TE Connectivity TRIAXIAL, 2000G, TRAY 25: USD140.17
10: USD145.176
1: USD160.19
 BuyNow
44
830M1-0050-TRAY-PACKAGED
223-830M1-0050-TRAY-PACKAGED-ND		 TE Connectivity TRIAXIAL, 50G, TRAY 10: USD68.575
1: USD70.11
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26

Bisco Industries

Part # Manufacturer Description Price BuyNow  Qty.
66900-134LF PACKAGED
 SUPPLY CHAIN # RV BuyNow
1

Heilind Electronics

Part # Manufacturer Description Price BuyNow  Qty.
830M1-0500-TRAY-PACKAGED
TSS20011426-01		 TE Connectivity BuyNow
0

Onlinecomponents.com

Part # Manufacturer Description Price BuyNow  Qty.
651-BLACK-PACKAGE
 Alpha Wire Black Bulk ft/Spool 100: USD105.73
75: USD107.89
50: USD156.88
25: USD297.25
 BuyNow
0
725-BLACK-PACKAGE
 Alpha Wire Black Bulk ft/Spool 250: USD52.53
100: USD54.59
50: USD55.43
25: USD56.27
10: USD61.49
5: USD63.44
1: USD71.35
 BuyNow
0
683/4-BLACK-PACKAGE
 Alpha Wire Black Bulk ft/Spool 50: USD350.08
38: USD357.23
25: USD531.79
13: USD1001.14
 BuyNow
0
674/4-BLACK-PACKAGE
 Alpha Wire Black Bulk ft/Spool 3: USD453.75
1: USD471.66
 BuyNow
1
727-BLACK-PACKAGE
 Alpha Wire Black Bulk ft/Spool 600: USD151.4
450: USD154.49
300: USD226.96
150: USD444.35
 BuyNow
0

TTI

Part # Manufacturer Description Price BuyNow  Qty.
0640160041
64016-0041		 Molex Crimpers / Crimping Tools HAND TOOL 1: USD63.45
5: USD59.2
10: USD58.04
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29
HRTS-5760-B-U-0-12
HRTS-5760-B-U-0-12		 Honeywell Sensing and Control Industrial Temperature Sensors 28 gauge, 1000 Ohm Ceramic case 1: USD58.59
25: USD55.8
250: USD53.14
 BuyNow
72
0640160035
64016-0035		 Molex Crimpers / Crimping Tools SERVICE TOOL 1: USD80.89
5: USD76.13
10: USD73.8
20: USD72.27
30: USD70.86
100: USD64.79
 BuyNow
21
747080-2
747080-2		 TE Connectivity D-Sub Tools & Hardware LATCH BLOCK 1: USD6.56
10: USD5.6
25: USD4.64
50: USD4.54
250: USD4.42
500: USD4.33
1000: USD4.25
 BuyNow
3071
0640160036
64016-0036		 Molex Crimpers / Crimping Tools HAND TOOL 1: USD80.39
5: USD75.82
10: USD72.77
25: USD71.34
50: USD67.96
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15

Interstate Connecting Components

Part # Manufacturer Description Price BuyNow  Qty.
830M1-0500-TRAY-PACKAGED
TSS20011426-01		 TE Connectivity BuyNow
0

Avnet Silica

Part # Manufacturer Description Price BuyNow  Qty.
PACKAGE-DBA
PACKAGE-DBA		 Renesas Electronics Corporation PACKAGE-DBA (Alt: PACKAGE-DBA) BuyNow
0

Master Electronics

Part # Manufacturer Description Price BuyNow  Qty.
674/4-BLACK-PACKAGE
 Alpha Wire Black Bulk ft/Spool 3: USD453.75
1: USD471.66
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1
ITC-E6XT-PACKAGE
 Teledyne FLIR 5: USD1861.09
3: USD1912.61
1: USD1966.95
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0
ITC-C5-PACKAGE
 Teledyne FLIR 10: USD737.01
5: USD748.24
3: USD768.86
1: USD780.56
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0
830M1-0100-TRAY-PACKAGED
 TE Connectivity 830M1-0100 Triaxial 100g Tray 25pcs 50: USD115.65
38: USD118.01
25: USD169.94
13: USD308.65
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0
830M1-2000-TRAY-PACKAGED
 TE Connectivity 830M1-2000 Triaxial 2Kg Tray 25pcs 50: USD115.65
38: USD118.01
25: USD169.94
13: USD308.65
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0

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