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    Infineon
Part No. FOA1061A1 FOA1062A1
OCR Text ...60 %; via holes to ground layer underneath the device; all pins soldered. 2) Do not exceed the maximum junction temperature. If used as packaged version, provide sufficient PCB heat sink to the device by soldering all pins and sufficient co...
Description 622 Mbit/s Transimpedance Amplifier

File Size 139.19K  /  8 Page

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    Infineon
Part No. FOA1121A1 FOA1122A1
OCR Text ...60 %; via holes to ground layer underneath the device; all pins soldered. 2) Do not exceed the maximum junction temperature. If used as packaged version, provide sufficient PCB heat sink to the device by soldering all pins and sufficient co...
Description 1.25 Gbit/s Transimpedance Amplifier

File Size 157.25K  /  9 Page

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    Infineon
Part No. FOA1251A1
OCR Text ...60 %; via holes to ground layer underneath the device; all pins soldered. 2) Do not exceed the maximum junction temperature. If used as packaged version, provide sufficient PCB heat sink to the device by soldering all pins and sufficient co...
Description 2.5 Gbit/s Transimpedance Amplifier

File Size 165.34K  /  9 Page

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    MAXIM - Dallas Semiconductor
Part No. MAX3289EVKIT-MAX3299EVKIT MAX3289EVKIT MAX3299EVKIT
OCR Text ...and notice that there is a hole underneath the exposed pad of the MAX3289 in the middle of the thermal pad. Place the tip of a soldering iron into the hole in the thermal pad. The MAX3289 should fall away from the board. 4) Use solder wick ...
Description Evaluation Kit for the MAX3289/MAX3299
From old datasheet system

File Size 184.88K  /  8 Page

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    EL4393 EL4393CM EL4393CN

Intersil Corporation
Part No. EL4393 EL4393CM EL4393CN
OCR Text ...ins. The ground plane should be underneath the package, but cut away from the In- inputs. Care should be taken with the center channel feedback--it must be kept away from any of the In+ or In- pins, if it has to go under the package. Route ...
Description Triple 80MHz Video Amplifier w/Disable

File Size 388.96K  /  9 Page

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    ICS557-08 ICS557G-08 ICS557G-08LF ICS557G-08LFT ICS557G-08T ICS557GI-08 ICS557GI-08LF ICS557GI-08LFT ICS557GI-08T

Integrated Circuit Systems
Part No. ICS557-08 ICS557G-08 ICS557G-08LF ICS557G-08LFT ICS557G-08T ICS557GI-08 ICS557GI-08LF ICS557GI-08LFT ICS557GI-08T
OCR Text ...his includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device. Load Resistors RL Since the clock outputs are open source outputs, 50 external resistors to ground are to be conn...
Description 2:1 MULTIPLEXER CHIP FOR PCI-EXPRESS

File Size 175.83K  /  11 Page

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    PERKINELMER[PerkinElmer Optoelectronics]
Part No. LC1917HAN-011 LC1917
OCR Text ...led by a potentiometer, located underneath the set screw on the body side of the camera adjacent to active www.perkinelmer.com/opto DSP-205.01A - 4/2001W Page 3 Video LEN CLT CLT equals 6 CLKS ...
Description Low-Profile Analog Line Scan Camera

File Size 489.29K  /  6 Page

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    Electronic Theatre Controls, Inc.
WJCI[WJ Communication. Inc.]
ETC[ETC]
WJ Communications
Part No. ECP053G-PCB2600 ECP053G ECP053G-PCB2450 ECP053 ECP053D ECP053D-PCB2450 ECP053D-PCB2600
OCR Text ...b Temperature (C) A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can occur without the use of one. Ground / thermal vias are critical for the prope...
Description Watt, High Linearity InGaP HBT Amplifier ?瓦,高线性InGaP HBT功率放大
1/2 Watt, High Linearity InGaP HBT Amplifier
Watt High Linearity InGaP HBT Amplifier

File Size 142.92K  /  3 Page

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