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CALMIRCO[California Micro Devices Corp]
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| Part No. |
CM3132-02SH CM3132 CM3132-02SB
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| OCR Text |
...layout. Note that there are six vias on either side to allow the heat to dissipate into the ground and power planes on the inner layers of the PCB. vias can be placed underneath the chip, but this can cause blockage of the solder. The groun... |
| Description |
Triple Linear Voltage Regulator for DDR-I Memory and CPU
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| File Size |
207.93K /
11 Page |
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it Online |
Download Datasheet
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CALMIRCO[California Micro Devices Corp]
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| Part No. |
CM3109-00SH CM3109 CM3109-00SB
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| OCR Text |
...layout. Note that there are six vias on either side to allow the heat to dissipate into the ground and power planes on the inner layers of the PCB. vias can be placed underneath the chip, but this can cause blockage of the solder. The groun... |
| Description |
2A Sink/Source Regulator for Front Side Bus and DDR Memory Bus Termination
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| File Size |
458.25K /
12 Page |
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it Online |
Download Datasheet |
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California Micro Devices Corporation
CALMIRCO[California Micro Devices Corp]
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| Part No. |
CM3106-12SN CM3106 CM3106-12SB CM3106-12SH CM3106-12SM
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| OCR Text |
...layout. Note that there are six vias on either side to allow the heat to dissipate into the ground and power planes on the inner layers of the PCB. vias can be placed underneath the chip, but this can cause blockage of the solder. The groun... |
| Description |
2 Amp Source/ Sink Bus Termination Regulator
2.0A Source/Sink Bus Termination Regulator
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| File Size |
976.72K /
11 Page |
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it Online |
Download Datasheet |
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United Monolithic Semic...
UMS[United Monolithic Semiconductors]
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| Part No. |
CHM1290REF_24 CHM1290REF CHM1290REF/24
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| OCR Text |
...a grid of plenty plated through vias with a diameter of less than 200m [8 mils] and a spacing of less than 400m [16 mils] from the centres of two adjacent vias. The via grid should cover the whole space under the ground pad and the vias clo... |
| Description |
20-30GHz SUB-HARMONICALLY PUMPED MIXER
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| File Size |
196.07K /
8 Page |
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it Online |
Download Datasheet |
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United Monolithic Semic...
UMS[United Monolithic Semiconductors]
United Monolithic Semiconductors GmbH
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| Part No. |
CHA5390TBF_24 CHA5390TBF CHA5390TBF/24
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| OCR Text |
...a grid of plenty plated through vias with a diameter of less than 200m [8 mils] and a spacing of less than 400m [16 mils] from the centres of two adjacent vias. The via grid should cover the whole space under the ground pad and the vias clo... |
| Description |
24-30GHz Medium Power Amplifier 24 - 30GHz的中等功率放大器
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| File Size |
167.02K /
6 Page |
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it Online |
Download Datasheet |
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United Monolithic Semiconductors GmbH
UMS[United Monolithic Semiconductors]
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| Part No. |
CHA5093TCF_24 CHA5093TCF CHA5093TCF/24
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| OCR Text |
...a grid of plenty plated through vias with a diameter of less than 200m [8 mils] and a spacing of less than 400m [16 mils] from the centres of two adjacent vias. The via grid should cover the whole space under the ground pad and the vias clo... |
| Description |
24-26GHz High Power Amplifier 24 - 26GHz高功率放大器
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| File Size |
151.10K /
6 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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