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  001456-8081 Datasheet PDF File

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    0014564072

Molex Electronics Ltd.
Part No. 0014564072
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 26, 0.76μm (30μ) Gold (Au), 7 Circuits

File Size 159.70K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-408081150LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0014564071 14-56-4071

Molex Electronics Ltd.
Part No. 0014564071 14-56-4071
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version D, Back Ribs, Wire Size 24, 0.76μm (30μ) Gold (Au), 7 Circuits

File Size 154.03K  /  3 Page

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Amphenol Communications Solutions

Part No. 10131318-08111G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 8 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    0014563194

Molex Electronics Ltd.
Part No. 0014563194
Description
File Size 158.53K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-108081200LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0014564131

Molex Electronics Ltd.
Part No. 0014564131
Description 2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female, Single Row, Version D, Back Ribs, Wire Size 24, 0.76楼矛m (30楼矛") Gold (Au), 13 Circ

File Size 154.06K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-808101500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    14-56-3022 0014563022

Molex Electronics Ltd.
Part No. 14-56-3022 0014563022
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version A, Nonpolarized, Wire Size 28, 0.76μm (30μ) Gold (Au), 2 Circuits

File Size 148.25K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-108081650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0014563168

Molex Electronics Ltd.
Part No. 0014563168
Description 2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 28, 0.38楼矛m (15楼矛") Gold (Au), 16 Cir

File Size 163.11K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-808181000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 18 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0014563167

Molex Electronics Ltd.
Part No. 0014563167
Description 2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female, Single Row, Version D, Back Ribs, Wire Size 26, 0.38楼矛m (15楼矛") Gold (Au), 16 Circ

File Size 158.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 83808-10010
Description Shield (Type I) closed end, with shield insulator
Tech specs    

Official Product Page

    0014563166

Molex Electronics Ltd.
Part No. 0014563166
Description 2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female,Single Row, Version C, Front Ribs, Wire Size 26, 0.38楼矛m (15楼矛") Gold (Au), 16 Circ

File Size 161.73K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-108081300LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0014563165

Molex Electronics Ltd.
Part No. 0014563165
Description 2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 24, 0.38楼矛m (15楼矛") Gold (Au), 16 Cir

File Size 161.66K  /  3 Page

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Amphenol Communications Solutions

Part No. 59112-S38-08-124LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 16 Positions.
Tech specs    

Official Product Page

    0014563164

Molex Electronics Ltd.
Part No. 0014563164
Description 2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female,Single Row, Version D, Back Ribs, Wire Size 24, 0.38楼矛m (15楼矛") Gold (Au), 16 Circu

File Size 158.53K  /  3 Page

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Amphenol Communications Solutions

Part No. 10142708-08100LF
Description Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 8 Positions, 15u\\ Gold (100u\\ Tin on Tails) plating, GW Compatible LCP, With Pegs, Tray.
Tech specs    

Official Product Page

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