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  87787-1011 Datasheet PDF File

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    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-4L
Description MICROWAVE POWER GaAs FET

File Size 145.86K  /  4 Page

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Amphenol Communications Solutions

Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-5L
Description MICROWAVE POWER GaAs FET

File Size 133.39K  /  5 Page

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Amphenol Communications Solutions

Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-8L
Description MICROWAVE POWER GaAs FET

File Size 132.08K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114829-10110LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
Tech specs    

Official Product Page

    MI1011T-01 MI1011T-02 MI1011T-03

List of Unclassifed Manufacturers
ETC
Part No. MI1011T-01 MI1011T-02 MI1011T-03
Description Thermoelectric Cooler

File Size 107.28K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114831-10113LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    NL1011T-01 NL1011T-02 NL1011T-03

List of Unclassifed Manufacturers
ETC
Part No. NL1011T-01 NL1011T-02 NL1011T-03
Description Thermoelectric Cooler

File Size 132.27K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    2SA1011

Inchange Semiconductor Company Limited
Part No. 2SA1011
Description Silicon PNP Power Transistors

File Size 112.27K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

    3021011-06

Qualtek Electronics Corporation
Part No. 3021011-06
Description USB 4P(A)/M - BLUNT CUT

File Size 374.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114828-10115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs    

Official Product Page

    VS1011E

ETC
Part No. VS1011E
Description MPEG AUDIO CODEC

File Size 473.55K  /  49 Page

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Amphenol Communications Solutions

Part No. 10114830-10111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs    

Official Product Page

    MJ11011

Inchange Semiconductor Company Limited
Part No. MJ11011
Description isc Silicon PNP Darlington Power Transistor

File Size 49.38K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114829-10115LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
Tech specs    

Official Product Page

    NEC, Corp.
Part No. NEZ1011-8E
Description X BAND, GaAs, N-CHANNEL, RF POWER, MESFET T-61, 2 PIN

File Size 22.64K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

For 87787-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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