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				IRF[International Rectifier]
Part No.	IRF9540S IRF9540STRL IRF9540STRR
OCR Text	... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The SMD-220 is suitable for high current applications...
Description	-100V Single P-Channel HEXFET Power MOSFET in a D2-Pak package
File Size	193.72K / 6 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRFZ24NL
OCR Text	... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2 Pak is suitable for high current applications b...
Description	Power MOSFET(Vdss=55V, Rds(on)=0.07ohm, Id=17A)
File Size	134.53K / 10 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRL6903L IRL6903S
OCR Text	... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2 Pak is suitable for high current applications b...
Description	HEXFET? Power MOSFET
File Size	147.82K / 10 Page	View it Online	Download Datasheet

				SAMSUNG[Samsung semiconductor] Samsung Electronic
Part No.	K9S2808V0B K9S2808V0C K9S5608V0B K9S5608V0C K9S6408V0B K9S6408V0C
OCR Text	...ed to memory cell arrays and is accommodating data-transfer between the I/O buffers and memory cell arrays during page read and page program operations. The memory array is made up of 16 cells that are serially connected to form a NAND stru...
Description	SmartMedia CARD
File Size	478.29K / 31 Page	View it Online	Download Datasheet

				Samsung Electronic Samsung semiconductor
Part No.	K9S2808V0M K9S2808V0M-SSB0
OCR Text	...connected to memory cell arrays accommodating data transfer between the I/O buffers and memory during page read and page program operations. The memory array is made up of 16 cells that are serially connected to form a NAND structure. Each ...
Description	16M x 8Bit SmartMedia?Card Data sheet 16M x 8 Bit SmartMedia Card
File Size	342.66K / 26 Page	View it Online	Download Datasheet

				CALMIRCO[California Micro Devices Corp]
Part No.	CMC7101A CMC7101AY CMC7101AR CMC7101AT
OCR Text	...ions The CMC7101A is capable of accommodating input common mode and output voltages equal to both power supply rails. Nor will voltages that exceed the supply voltages cause phase inversion of the output. However, ESD diode clamps are provi...
Description	CMC7101A Low Power Operational Amplifier, RRIO, SOT23-5
File Size	463.77K / 10 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRFZ34L IRFZ34S
OCR Text	... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D 2Pak is suitable for high current applications b...
Description	HEXFET Power MOSFET
File Size	277.20K / 10 Page	View it Online	Download Datasheet

				PMC-Sierra, Inc.
Part No.	PM5342
OCR Text	...oad to system timing reference, accommodating plesiochronous timing offsets between the references through pointer processing. TSLDCLK, TOWCLK TSLD, TSOW, TSUC BACKPLANE/DEVICE MODES * * * * * * * Telecom Byte. Telecom Nibble. Telecom ...
Description	SONET/SDH Payload Extractor/Aligner ATM/SONET/SDH SUPPORT CIRCUIT, PBGA256
File Size	33.51K / 2 Page	View it Online	Download Datasheet

				RF Micro Devices, Inc. RFMD[RF Micro Devices]
Part No.	RF3163 RF3163PCBA
OCR Text	...ements of the device as well as accommodating routing strategies. The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on...
Description	3V 900MHZ LINEAR POWER AMPLIFIER MODULE 3V00MHz的线性功率放大器模块
File Size	76.36K / 8 Page	View it Online	Download Datasheet

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