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2N4123 BYV32 D1215 2SC111 CL7808DT MAX1063 37128 0PT10
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    IRF9540S IRF9540STRL IRF9540STRR

IRF[International Rectifier]
Part No. IRF9540S IRF9540STRL IRF9540STRR
OCR Text ... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The SMD-220 is suitable for high current applications...
Description -100V Single P-Channel HEXFET Power MOSFET in a D2-Pak package

File Size 193.72K  /  6 Page

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    IRFZ24NL

International Rectifier
Part No. IRFZ24NL
OCR Text ... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2 Pak is suitable for high current applications b...
Description Power MOSFET(Vdss=55V, Rds(on)=0.07ohm, Id=17A)

File Size 134.53K  /  10 Page

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    IRL6903L IRL6903S

International Rectifier
Part No. IRL6903L IRL6903S
OCR Text ... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2 Pak is suitable for high current applications b...
Description HEXFET? Power MOSFET

File Size 147.82K  /  10 Page

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    K9S2808V0B K9S2808V0C K9S5608V0B K9S5608V0C K9S6408V0B K9S6408V0C

SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K9S2808V0B K9S2808V0C K9S5608V0B K9S5608V0C K9S6408V0B K9S6408V0C
OCR Text ...ed to memory cell arrays and is accommodating data-transfer between the I/O buffers and memory cell arrays during page read and page program operations. The memory array is made up of 16 cells that are serially connected to form a NAND stru...
Description SmartMedia CARD

File Size 478.29K  /  31 Page

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    K9S2808V0M K9S2808V0M-SSB0

Samsung Electronic
Samsung semiconductor
Part No. K9S2808V0M K9S2808V0M-SSB0
OCR Text ...connected to memory cell arrays accommodating data transfer between the I/O buffers and memory during page read and page program operations. The memory array is made up of 16 cells that are serially connected to form a NAND structure. Each ...
Description 16M x 8Bit SmartMedia?Card Data sheet
16M x 8 Bit SmartMedia Card

File Size 342.66K  /  26 Page

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    CMC7101A CMC7101AY CMC7101AR CMC7101AT

CALMIRCO[California Micro Devices Corp]
Part No. CMC7101A CMC7101AY CMC7101AR CMC7101AT
OCR Text ...ions The CMC7101A is capable of accommodating input common mode and output voltages equal to both power supply rails. Nor will voltages that exceed the supply voltages cause phase inversion of the output. However, ESD diode clamps are provi...
Description CMC7101A Low Power Operational Amplifier, RRIO, SOT23-5

File Size 463.77K  /  10 Page

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    IRFZ34L IRFZ34S

International Rectifier
Part No. IRFZ34L IRFZ34S
OCR Text ... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D 2Pak is suitable for high current applications b...
Description HEXFET Power MOSFET

File Size 277.20K  /  10 Page

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    PM5342

PMC-Sierra, Inc.
Part No. PM5342
OCR Text ...oad to system timing reference, accommodating plesiochronous timing offsets between the references through pointer processing. TSLDCLK, TOWCLK TSLD, TSOW, TSUC BACKPLANE/DEVICE MODES * * * * * * * Telecom Byte. Telecom Nibble. Telecom ...
Description SONET/SDH Payload Extractor/Aligner ATM/SONET/SDH SUPPORT CIRCUIT, PBGA256

File Size 33.51K  /  2 Page

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    RF3163 RF3163PCBA

RF Micro Devices, Inc.
RFMD[RF Micro Devices]
Part No. RF3163 RF3163PCBA
OCR Text ...ements of the device as well as accommodating routing strategies. The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on...
Description 3V 900MHZ LINEAR POWER AMPLIFIER MODULE 3V00MHz的线性功率放大器模块

File Size 76.36K  /  8 Page

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