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				COOPER INDUSTRIES
Part No.	UP4B-151-R
OCR Text	...nductors (surface mount) parts packaged on 13" diameter reel, 900 parts per reel. parts packaged on 13" diameter reel, 550 parts per reel. parts packaged on 13" diameter reel, 450 parts per reel. parts packaged on 13" diameter reel, 27...
Description	1 ELEMENT, 150 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
File Size	749.32K / 6 Page	View it Online	Download Datasheet

				BOURNS[Bourns Electronic Solutions]
Part No.	2DAA-F6RLF 2DAA-F6R
OCR Text	...s a silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The gri...
Description	Integrated Passive & Active Device
File Size	222.37K / 4 Page	View it Online	Download Datasheet

				BOURNS[Bourns Electronic Solutions]
Part No.	2DAB-F6RLF 2DAB-F6R
OCR Text	...s a silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The gri...
Description	Integrated Passive & Active Device
File Size	222.58K / 4 Page	View it Online	Download Datasheet

				Bourns Electronic Solutions
Part No.	2DAC-C16R 2DAC-C16RLF
OCR Text	...s a Silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the Silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The gri...
Description	Integrated Passive & Active Device using CSP
File Size	232.59K / 4 Page	View it Online	Download Datasheet

				BOURNS[Bourns Electronic Solutions]
Part No.	2DAD-C5RLF 2DAD-C5R
OCR Text	...s a silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the silicon die, provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The gri...
Description	Integrated Passive & Active Device using CSP
File Size	213.15K / 4 Page	View it Online	Download Datasheet

				ETC
Part No.	SMV1250-001 SMV1250-004 SMV1250-011
OCR Text	packaged Surface Mount Varactor Diodes 2 Features Industry Standard Outlines: SOD-323 and SOT-23 Packages High "Q" Abrupt and Hyperabrupt Junction Designs Single, Common Anode and Common Cathode Configurations Available for 3 Volt Batt...
Description	Plastic packaged Surface Mount Varactor Diodes
File Size	93.76K / 7 Page	View it Online	Download Datasheet

				Bourns Electronic Solutions Bourns, Inc.
Part No.	2FAB-M20R
OCR Text	...ns This silicon-based device is packaged using micro leadframe packaging technology. The MLPs have an exposed die attach pad that provides the interconnect medium from die to PCB. The pads are arranged for easy PCB routing. The pitch is 0.5...
Description	Integrated Passive & Active Device using MLP
File Size	290.45K / 4 Page	View it Online	Download Datasheet

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