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| Part No. |
AN-9046
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| OCR Text |
...tion of the flux in the solder paste. figure 2 : exposed copper on package edge, with solder wetting after reflow, from singulation process. pwb design considerations any land pad pattern must take into account the various pwb and ... |
| Description |
Dual Power56 Packaging
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| File Size |
850.15K /
10 Page |
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it Online |
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| Part No. |
AN-9048
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| OCR Text |
...tion of the flux in the solder paste. pwb design considerations any land pad pattern must take into account the various tolerances involved in production of the pwb and the assembly operations required for soldering the drmos to the... |
| Description |
6x6 DriverMOS Packaging
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| File Size |
746.79K /
9 Page |
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it Online |
Download Datasheet |
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TVS二极- 瞬态电压抑
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| Part No. |
IP4234CZ6
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| OCR Text |
...rocess involves applying solder paste to a board, followed by component placement and exposure to a temperature pro?le. leaded packages, packages with solder balls, and leadless packages are all re?ow solderable. key characteristics in both... |
| Description |
Single USB 2.0 ESD protection to IEC 61000-4-2 level 4
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| File Size |
52.30K /
9 Page |
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it Online |
Download Datasheet |
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Murata Manufacturing Co...
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| Part No. |
NFM21HC104R1A3
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| OCR Text |
...dard printing pattern of solder paste. 1) soldering paste printing for reflow ? standard thickness of solder paste: 100m to 150m. ? use the solder paste printing pattern of the right pattern. ? for the resist and copper foil pattern, use st... |
| Description |
This product specification is applied to Chip EMIFIL
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| File Size |
268.17K /
11 Page |
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it Online |
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