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2N2484 TIC263D 1N4761 LTC18 2N3906 40T03 87FE2051 KBL407
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  vias Datasheet PDF File

For vias Found Datasheets File :: 6518    Search Time::0.781ms    
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    United Monolithic Semicondu...
UMS[United Monolithic Semiconductors]
United Monolithic Semiconductors GmbH
Part No. CHA2069RAF_24 CHA2069RAF CHA2069RAF/24
OCR Text ...a grid of plenty plated through vias with a diameter of less than 200m [8 mils] and a spacing of less than 400m [16 mils] from the centres of two adjacent vias. The via grid should cover the whole space under the ground pad and the vias clo...
Description Circular Connector; No. of Contacts:100; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:23; Circular Contact Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:23-35 RoHS Compliant: No
18-31GHz Low Noise Amplifier 18 - 31GHz之间低噪声放大器

File Size 169.36K  /  7 Page

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    TQP13-N

TriQuint Semiconductor
Part No. TQP13-N
OCR Text ... ? epi resistor ? backside vias ? high volume 150 mm wafers ? same baseline as mass produc- tion today applications ? dbs lnb and down convert ? automotive radar ? satellite communications ? low noise point to poi...
Description    0.13 um D pHEMT Foundry Service

File Size 173.15K  /  4 Page

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    United Monolithic Semicondu...
UMS[United Monolithic Semiconductors]
Part No. CHA2066RBF_24 CHA2066RBF CHA2066RBF/24
OCR Text ...a grid of plenty plated through vias with a diameter of less than 200m [8 mils] and a spacing of less than 400m [16 mils] from the centres of two adjacent vias. The via grid should cover the whole space under the ground pad and the vias clo...
Description 10-16GHz Self biased Low Noise Amplifier

File Size 179.82K  /  8 Page

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    http://
FAIRCHILD[Fairchild Semiconductor]
Fairchild Semiconductor Corporation
Part No. AN-5026
OCR Text ...3-bit switch without the use of vias. Routing Power and Ground: Power and ground balls have not been routed in the illustrations above because of the designers multiple routing choices. There are generally two methods: 1. Supplying power...
Description Using BGA Packages
Contact Gender:Pin; Circular Shell Style:Wall Mount Receptacle; Insert Arrangement:15-19 RoHS Compliant: No

File Size 720.16K  /  8 Page

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    ICS308RILF ICS308RILFT ICS308R ICS308RI ICS308RIT ICS308RLF ICS308RLFT ICS308RT

Integrated Device Technology
Part No. ICS308RILF ICS308RILFT ICS308R ICS308RI ICS308RIT ICS308RLF ICS308RLFT ICS308RT
OCR Text ... to the VDD pin as possible. No vias should be used between decoupling capacitor and VDD pin. The PCB trace to VDD pin should be kept as short as possible, as should the PCB trace to the ground via. 2) The external crystal should be mounted...
Description SERIAL PROGRAMMABLE QUAD PLL VERSACLOCK SYNTHESIZER

File Size 141.23K  /  9 Page

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    ICS2509 ICS2509C ICS2509CYG-T

ICST[Integrated Circuit Systems]
ICST [Integrated Circuit Systems]
Part No. ICS2509 ICS2509C ICS2509CYG-T
OCR Text ...ght is an example. 2) Use power vias for power and ground. vias 20 mil or larger in diameter have lower high frequency impedance. vias for signals may be minimum drill size. 3) Make all power and ground traces are as wide as the via pad for...
Description 3.3V Phase-Lock Loop Clock Driver

File Size 246.39K  /  7 Page

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    WJCI[WJ Communication. Inc.]
Part No. AH11PP900-PCB AH11 AH11BAL-PCB AH11-G AH11PP1900-PCB
OCR Text ...(C) 110 9. Ground / thermal vias are critical for the proper performance of this device. vias should use a .35mm (#80/.0135") diameter drill and have a final plated through diameter of .25mm (.010") Add as much copper as possible to inn...
Description High Dynamic Range Dual Amplifier

File Size 313.95K  /  6 Page

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    Integrated Device Techn...
Part No. IDT5V41285
OCR Text ...s possible. do not share ground vias between components. route power from power source through the capacitor pad and then into ics pin. crystal a 25 mhz fundamental mode parallel resonant crystal should be used. this crystal must have l...
Description    2 OUTPUT PCIE GEN1/2 SYNTHESIZER

File Size 303.79K  /  17 Page

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