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  39512-1011 Datasheet PDF File

For 39512-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    PCA Electronics
Part No. EPC1011
Description DC-DC Converter
File Size 75.86K  /  1 Page

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Amphenol Communications Solutions
Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    MJ11011

Inchange Semiconductor Company Limited
Part No. MJ11011
Description isc Silicon PNP Darlington Power Transistor
File Size 49.38K  /  2 Page

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Amphenol Communications Solutions
Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    2SB1011 B1011

PANASONIC[Panasonic Semiconductor]
Part No. 2SB1011 B1011
Description 2SB1011
Silicon PNP triple diffusion planar type
File Size 77.42K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114829-10110LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
Tech specs 　 　

Official Product Page

    PS11011

Mitsubishi Electric Semiconductor
POWEREX[Powerex Power Semiconductors]
Part No. PS11011
Description Application Specific Intelligent Power Module FLAT-BASE TYPE INSULATED PACKAGE
FLAT-BASE TYPE INSULATED TYPE
File Size 405.78K  /  6 Page

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Amphenol Communications Solutions
Part No. 10114831-10113LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-4L
Description MICROWAVE POWER GaAs FET
File Size 145.86K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-5L
Description MICROWAVE POWER GaAs FET
File Size 133.39K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs 　 　

Official Product Page

    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-8L
Description MICROWAVE POWER GaAs FET
File Size 132.08K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114828-10115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs 　 　

Official Product Page

    MI1011T-01 MI1011T-02 MI1011T-03

List of Unclassifed Manufacturers
ETC
Part No. MI1011T-01 MI1011T-02 MI1011T-03
Description Thermoelectric Cooler
File Size 107.28K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114830-10111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs 　 　

Official Product Page

    NL1011T-01 NL1011T-02 NL1011T-03

List of Unclassifed Manufacturers
ETC
Part No. NL1011T-01 NL1011T-02 NL1011T-03
Description Thermoelectric Cooler
File Size 132.27K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114829-10115LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
Tech specs 　 　

Official Product Page

    2SA1011

Inchange Semiconductor Company Limited
Part No. 2SA1011
Description Silicon PNP Power Transistors
File Size 112.27K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

For 39512-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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