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  522-43-056-09-041001 Datasheet PDF File

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    70563-0003

Molex Electronics Ltd.
Part No. 70563-0003
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 4Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 214.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 10142708-041001LF
Description Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 4 Positions, 15u\\ Gold (100u\\ Tin on Tails) plating, GW Compatible LCP, Without Pegs, Tray.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70563-0009

Molex Electronics Ltd.
Part No. 70563-0009
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 10Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 214.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 10061404-10010TLF
Description PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, 140 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    70563-0012

Molex Electronics Ltd.
Part No. 70563-0012
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 13Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 214.09K  /  4 Page

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    A-70567-0279

Molex Electronics Ltd.
Part No. A-70567-0279
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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    70563-0013

Molex Electronics Ltd.
Part No. 70563-0013
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 14Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 214.21K  /  4 Page

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    70567-0125

Molex Electronics Ltd.
Part No. 70567-0125
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating

File Size 1,211.75K  /  7 Page

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    70567-0018

Molex Electronics Ltd.
Part No. 70567-0018
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

File Size 1,218.45K  /  7 Page

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    70563-0047

Molex Electronics Ltd.
Part No. 70563-0047
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 13Circuits, Tin (Sn) Plating

File Size 214.05K  /  4 Page

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    70563-0041

Molex Electronics Ltd.
Part No. 70563-0041
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 7 Circuits, Tin (Sn) Plating

File Size 214.17K  /  4 Page

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    70563-0039

Molex Electronics Ltd.
Part No. 70563-0039
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .180 Pocket, Shrouded, 5 Circuits, Tin (Sn) Plating

File Size 214.17K  /  4 Page

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