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  90130-1316 Datasheet PDF File

For 90130-1316 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    0901301340

Molex Electronics Ltd.
Part No. 0901301340
Description
File Size 585.97K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-6216-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901301130 90130-1130

Molex Electronics Ltd.
Part No. 0901301130 90130-1130
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 30 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-6518-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0901303340

Molex Electronics Ltd.
Part No. 0901303340
Description
File Size 168.46K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-6314-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Left End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    0901301138 90130-1138

Molex Electronics Ltd.
Part No. 0901301138 90130-1138
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 38 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.91K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-6616-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    0901303208 90130-3208

Molex Electronics Ltd.
Part No. 0901303208 90130-3208
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 8 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 8 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating

File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-6318-21D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0901301110 90130-1110

Molex Electronics Ltd.
Part No. 0901301110 90130-1110
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.90K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-6114-21H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    0901308212

Molex Electronics Ltd.
Part No. 0901308212
Description 2.54mm (.100) Pitch C-Grid III?Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 162.90K  /  4 Page

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    0510901300 51090-1300

Molex Electronics Ltd.
Part No. 0510901300 51090-1300
Description 2.00mm (.079) Pitch Mi II?/a> System Wire-to-Board Crimp Housing, Single Row, 13Circuits
2.00mm (.079) Pitch Mi II System Wire-to-Board Crimp Housing, Single Row, 13Circuits

File Size 87.21K  /  2 Page

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    0901301106 90130-1106

Molex Electronics Ltd.
Part No. 0901301106 90130-1106
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded 6 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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    0901301136 90130-1136

Molex Electronics Ltd.
Part No. 0901301136 90130-1136
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 36 Circuits, Black, 3μm (118μ) Tin(Sn) over Nickel (Ni), Lead free

File Size 586.02K  /  7 Page

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