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				IRF[International Rectifier]
Part No.	IRFZ48S IRFZ48L
OCR Text	... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications be...
Description	HEXFET Power MOSFET
File Size	294.77K / 10 Page	View it Online	Download Datasheet

				Samsung Electronic Samsung semiconductor
Part No.	K9D1G08V0M K9D1G08V0M_A-SSB0 K9D1G08V0M/A-SSB0 K9S1208V0 K9S1208V0M/A-SSB0
OCR Text	...ed to memory cell arrays and is accommodating data-transfer between the I/O buffers and memory cell arrays during page read and page program operations. The memory array is made up of 16 cells that are serially connected to form a NAND stru...
Description	64MB & 128MB SmartMediaTM Card
File Size	653.57K / 37 Page	View it Online	Download Datasheet

				SAMSUNG[Samsung semiconductor] Samsung Electronic
Part No.	K9F8008W0M- K9F8008W0M-TCB0 K9F8008W0M-TIB0 K9K1208D0C
OCR Text	...connected to memory cell arrays accommodating data transfer between the I/O buffers and memory during page read and page program operations. The memory array is made up of 16 cells that are serially connected to form a NAND structure. Each ...
Description	64M x 8 Bit / 32M x 16 Bit NAND Flash Memory 1M x 8 bit NAND Flash Memory
File Size	442.73K / 25 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRLZ34NL IRLZ34NS
OCR Text	... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications be...
Description	HEXFET? Power MOSFET
File Size	176.30K / 10 Page	View it Online	Download Datasheet

				AMCC
Part No.	S3067
OCR Text	... countries. SONET is capable of accommodating a variety of transmission rates and applications. The SONET standard is a layered protocol with four separate layers defined. These are: * Photonic * Section * Line * Path Figure 2 shows the lay...
Description	Multi-rate (OC-48/24/12/3/GBE) Sonet/sdh/atm Transceiver With Fec
File Size	246.27K / 27 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IRFZ34VL IRFZ34VS
OCR Text	... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2 Pak is suitable for high current applications ...
Description	60V Single N-Channel HEXFET Power MOSFET in a D2-Pak package 60V Single N-Channel HEXFET Power MOSFET in a TO-262 package HEXFET? Power MOSFET Advanced Process Technology
File Size	126.38K / 10 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IRL2703S IRL2703STRL IRL2703STRR
OCR Text	... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2PAK is suitable for high current applications be...
Description	30V Single N-Channel HEXFET Power MOSFET in a D2-Pak package HEXFET? Power MOSFET
File Size	130.72K / 9 Page	View it Online	Download Datasheet

				Dynex Semiconductor
Part No.	MA31751
OCR Text	...roup contains 16 page registers accommodating a total of 256 registers for each of operand and instruction memory space. The MMU also checks for protection violation by comparing the processor state (PS), read from the CPU status word, with...
Description	Memory Management & Block Protection Unit
File Size	160.34K / 17 Page	View it Online	Download Datasheet

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