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VPR22 44MHZ FCX59606 1V102M PTQTP N3035 1206C 9952A
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  assembly-type Datasheet PDF File

For assembly-type Found Datasheets File :: 21595    Search Time::4.859ms    
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    MAX1546ETL

MAXIM - Dallas Semiconductor
Maxim Integrated Products
Part No. MAX1546ETL
OCR Text ...rs: D. Fabrication Location: E. Assembly Location: F. Date of Initial Production: Dual-Phase, Quick-PWM Controller for IMVP CPU Core Power S...Type: B. Lead Frame: C. Lead Finish: D. Die Attach: E. Bondwire: F. Mold Material: G. Assembly Diagr...
Description PLASTIC ENCAPSULATED DEVICES

File Size 119.24K  /  8 Page

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    MAX3801UGG

MAXIM - Dallas Semiconductor
MAXIM[Maxim Integrated Products]
Part No. MAX3801UGG
OCR Text ...rs: D. Fabrication Location: E. Assembly Location: F. Date of Initial Production: 3.2Gbps Adaptive Equalizer GST33 981 Oregon, USA Korea April, 2001 III. Packaging Information A. Package Type: B. Lead Frame: C. Lead Finish: D. Die Attach...
Description PLASTIC ENCAPSULATED DEVICES

File Size 65.71K  /  7 Page

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    MP02X130 MP02X130-16 MP02X130-18 MP02X130-20

Dynex Semiconductor Ltd.
DYNEX[Dynex Semiconductor]
Part No. MP02X130 MP02X130-16 MP02X130-18 MP02X130-20
OCR Text ...com MP02X130 Series POWER ASSEMBLY CAPABILITY The Power Assembly group provides support for those customers requiring more than the basic semiconductor switch. Using CAD design tools the group has developed a flexible range of heatsi...
Description MB 32C 32#20 PIN RECP
Phase Control Dual SCR, SCR/Diode Modules

File Size 111.50K  /  8 Page

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    MP02X175 MP02X175-10 MP02X175-12 MP02X175-14 MP02X175-16

Dynex Semiconductor Ltd.
DYNEX[Dynex Semiconductor]
Part No. MP02X175 MP02X175-10 MP02X175-12 MP02X175-14 MP02X175-16
OCR Text ...com MP02X175 Series POWER ASSEMBLY CAPABILITY The Power Assembly group provides support for those customers requiring more than the basic semiconductor switch. Using CAD design tools the group has developed a flexible range of heatsi...
Description MB 16C 16#16 PIN RECP
MB 32C 32#20 SKT RECP
MB 8C 8#12 SKT RECP
Phase Control Dual SCR, SCR/Diode Modules

File Size 114.19K  /  8 Page

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    MP03XXX130 MP03_130-16 MP03_130-18 MP03_130-20 MP03/130-16 MP03/130-18 MP03/130-20 MP03HBT130-20

Dynex Semiconductor Ltd.
DYNEX[Dynex Semiconductor]
Part No. MP03XXX130 MP03_130-16 MP03_130-18 MP03_130-20 MP03/130-16 MP03/130-18 MP03/130-20 MP03HBT130-20
OCR Text ...r AN4506 AN4853 AN5001 POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping...
Description 210 A, 2000 V, SCR
MB 31C 31#16 SKT RECP
MB 31C 31#16 PIN RECP
MB 19C 19#12 SKT RECP
Phase Control Dual SCR, SCR/Diode Modules

File Size 111.83K  /  10 Page

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    MX9691L

MCNIX[Macronix International]
Part No. MX9691L
OCR Text ...test cover basic PCB test after assembly and more detial analysis. * Logical sector test cover SSD functionality and data transfer test. ...type or series type flash memory chip. It is typically configured with up to 32MB(unformatted) capac...
Description SINGLE CHIP SOLID STATE DISK CONTROLLER

File Size 192.04K  /  41 Page

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    PZT651T1 ON2780 PZT65

ONSEMI[ON Semiconductor]
Part No. PZT651T1 ON2780 PZT65
OCR Text ...0 SECONDS (DEPENDING ON MASS OF ASSEMBLY) 200C TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 2. Typical Solder Heating Profile 4 Motorola Small-Signal Transistors, FETs and Diodes Device Data PZT651T1 PACKAGE DIMENSIONS A F NO...
Description From old datasheet system
HIGH CURRENT NPN SILICON TRANSISTOR SURFACE MOUNT

File Size 101.17K  /  6 Page

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    TMP01 TMP01EP TMP01ES TMP01FJ2 TMP01FP TMP01FS TMP01GBC

AD[Analog Devices]
Part No. TMP01 TMP01EP TMP01ES TMP01FJ2 TMP01FP TMP01FS TMP01GBC
OCR Text ...its shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. C...Type 8-Pin Plastic DIP (P) 8-Lead SOIC (S) 8-Lead TO-99 Can (J) JA 1031 1582 1501 JC 43 43 18 Units ...
Description Low Power, Programmable Temperature Controller

File Size 370.73K  /  16 Page

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    TMP03 TMP03FRU TMP03FS TMP03FT9 TMP03GBC TMP04 TMP04FRU TMP04FS TMP04FT9 TMP04GBC

AD[Analog Devices]
Part No. TMP03 TMP03FRU TMP03FS TMP03FT9 TMP03GBC TMP04 TMP04FRU TMP04FS TMP04FT9 TMP04GBC
OCR Text ...its shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. C...Type TO-92 (T9) SO-8 (S) TSSOP (RU) JA 1621 1581 2401 JC 120 43 43 Units C/W C/W C/W ORD...
Description Serial Digital Output Thermometers

File Size 366.68K  /  16 Page

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    VW2010

List of Unclassifed Manufacturers
ETC[ETC]
Part No. VW2010
OCR Text ... management * Boundary scan and assembly testing compliant with IEEE 1149.1 (JTAG) and EPI EJTAG 2.0 (extended JTAG) Decreases time to market * Easy to setup and configure Interfaces Host Interfaces * 8- or 16-bit Motorola-style in...
Description MPEG-1, -2, -4 Audio/Video CODEC Chip

File Size 353.22K  /  2 Page

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