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For assembly-type Found Datasheets File :: 21595 Search Time::4.859ms
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				MAXIM - Dallas Semiconductor Maxim Integrated Products
Part No.	MAX1546ETL
OCR Text	...rs: D. Fabrication Location: E. Assembly Location: F. Date of Initial Production: Dual-Phase, Quick-PWM Controller for IMVP CPU Core Power S...Type: B. Lead Frame: C. Lead Finish: D. Die Attach: E. Bondwire: F. Mold Material: G. Assembly Diagr...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	119.24K / 8 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products]
Part No.	MAX3801UGG
OCR Text	...rs: D. Fabrication Location: E. Assembly Location: F. Date of Initial Production: 3.2Gbps Adaptive Equalizer GST33 981 Oregon, USA Korea April, 2001 III. Packaging Information A. Package Type: B. Lead Frame: C. Lead Finish: D. Die Attach...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	65.71K / 7 Page	View it Online	Download Datasheet

				Dynex Semiconductor Ltd. DYNEX[Dynex Semiconductor]
Part No.	MP02X130 MP02X130-16 MP02X130-18 MP02X130-20
OCR Text	...com MP02X130 Series POWER ASSEMBLY CAPABILITY The Power Assembly group provides support for those customers requiring more than the basic semiconductor switch. Using CAD design tools the group has developed a flexible range of heatsi...
Description	MB 32C 32#20 PIN RECP Phase Control Dual SCR, SCR/Diode Modules
File Size	111.50K / 8 Page	View it Online	Download Datasheet

				Dynex Semiconductor Ltd. DYNEX[Dynex Semiconductor]
Part No.	MP02X175 MP02X175-10 MP02X175-12 MP02X175-14 MP02X175-16
OCR Text	...com MP02X175 Series POWER ASSEMBLY CAPABILITY The Power Assembly group provides support for those customers requiring more than the basic semiconductor switch. Using CAD design tools the group has developed a flexible range of heatsi...
Description	MB 16C 16#16 PIN RECP MB 32C 32#20 SKT RECP MB 8C 8#12 SKT RECP Phase Control Dual SCR, SCR/Diode Modules
File Size	114.19K / 8 Page	View it Online	Download Datasheet

				Dynex Semiconductor Ltd. DYNEX[Dynex Semiconductor]
Part No.	MP03XXX130 MP03_130-16 MP03_130-18 MP03_130-20 MP03/130-16 MP03/130-18 MP03/130-20 MP03HBT130-20
OCR Text	...r AN4506 AN4853 AN5001 POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping...
Description	210 A, 2000 V, SCR MB 31C 31#16 SKT RECP MB 31C 31#16 PIN RECP MB 19C 19#12 SKT RECP Phase Control Dual SCR, SCR/Diode Modules
File Size	111.83K / 10 Page	View it Online	Download Datasheet

				MCNIX[Macronix International]
Part No.	MX9691L
OCR Text	...test cover basic PCB test after assembly and more detial analysis. * Logical sector test cover SSD functionality and data transfer test. ...type or series type flash memory chip. It is typically configured with up to 32MB(unformatted) capac...
Description	SINGLE CHIP SOLID STATE DISK CONTROLLER
File Size	192.04K / 41 Page	View it Online	Download Datasheet

				ONSEMI[ON Semiconductor]
Part No.	PZT651T1 ON2780 PZT65
OCR Text	...0 SECONDS (DEPENDING ON MASS OF ASSEMBLY) 200C TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 2. Typical Solder Heating Profile 4 Motorola Small-Signal Transistors, FETs and Diodes Device Data PZT651T1 PACKAGE DIMENSIONS A F NO...
Description	From old datasheet system HIGH CURRENT NPN SILICON TRANSISTOR SURFACE MOUNT
File Size	101.17K / 6 Page	View it Online	Download Datasheet

				AD[Analog Devices]
Part No.	TMP01 TMP01EP TMP01ES TMP01FJ2 TMP01FP TMP01FS TMP01GBC
OCR Text	...its shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. C...Type 8-Pin Plastic DIP (P) 8-Lead SOIC (S) 8-Lead TO-99 Can (J) JA 1031 1582 1501 JC 43 43 18 Units ...
Description	Low Power, Programmable Temperature Controller
File Size	370.73K / 16 Page	View it Online	Download Datasheet

				AD[Analog Devices]
Part No.	TMP03 TMP03FRU TMP03FS TMP03FT9 TMP03GBC TMP04 TMP04FRU TMP04FS TMP04FT9 TMP04GBC
OCR Text	...its shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. C...Type TO-92 (T9) SO-8 (S) TSSOP (RU) JA 1621 1581 2401 JC 120 43 43 Units C/W C/W C/W ORD...
Description	Serial Digital Output Thermometers
File Size	366.68K / 16 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers ETC[ETC]
Part No.	VW2010
OCR Text	... management * Boundary scan and assembly testing compliant with IEEE 1149.1 (JTAG) and EPI EJTAG 2.0 (extended JTAG) Decreases time to market * Easy to setup and configure Interfaces Host Interfaces * 8- or 16-bit Motorola-style in...
Description	MPEG-1, -2, -4 Audio/Video CODEC Chip
File Size	353.22K / 2 Page	View it Online	Download Datasheet

For assembly-type Found Datasheets File :: 21595 Search Time::4.859ms
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