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ONSEMI[ON Semiconductor]
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| Part No. |
MMFT960T1
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| OCR Text |
...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C.
80 0.0
Figure 9. Thermal Resistance versus Collector Pad Area for the SOT-223 Package (Typical)
board, the pow... |
| Description |
Power MOSFET 300 mA, 60 Volts
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| File Size |
78.46K /
8 Page |
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FAIRCHILD SEMICONDUCTOR CORP
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| Part No. |
KA7809RI
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| OCR Text |
...rature. changes in v o due to heating effects must be taken into account separately. pulse testing with low duty is used. characteristic symbol value unit input voltage (for v o = 5v to 18v) (for v o = 24v) v i v i 35... |
| Description |
9 V FIXED POSITIVE REGULATOR, PSSO2
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| File Size |
267.07K /
27 Page |
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it Online |
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MOTOROLA INC
Motorola, Inc.
MOTOROLA[Motorola, Inc]
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| Part No. |
MMQA MMQA18VT1
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| OCR Text |
...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the devi... |
| Description |
150 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE
SC-59 Quad Monolithic Common Anode
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| File Size |
102.36K /
8 Page |
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it Online |
Download Datasheet |
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ONSEMI[ON Semiconductor]
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| Part No. |
MR2510 MR2502 MR2504 MR2500-D
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| OCR Text |
...at severe thermal shock (either heating or cooling) be avoided as it may lead to damage of the die or encapsulant of the part. Button holding fixtures for use during soldering may be of various materials. Stainless steel has a longer use li... |
| Description |
25A 1000V Silicon Rectifier
Medium-Current Silicon Rectifiers
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| File Size |
91.78K /
8 Page |
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it Online |
Download Datasheet |
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