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11X52 L74VHC1G C6707 25G102 E8267D CHN217 47C101P H161F
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For moulding Found Datasheets File :: 308    Search Time::6.172ms    
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    DBCTB85-2 DBCTB85-3

Dubilier
Part No. DBCTB85-2 DBCTB85-3
OCR Text ...king temperature: Short Period: moulding: 20A/250V 2.5KV/60sec 5M -20C to 125C 160 UL94V-0 flame retardant PA66 Pin/terminal: Wire protector: Screw/torque: Recommended PCB hole size: 5 tinned, nickel plated brass Nickel plated brass M3 stee...
Description TERMINAL BLOCKS 5.08mm PITCH 90 MOUNT

File Size 80.05K  /  1 Page

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    IRLI3705N IRLI3705

IRF[International Rectifier]
Part No. IRLI3705N IRLI3705
OCR Text ...al-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO...
Description 55V Single N-Channel HEXFET Power MOSFET in a TO-220 FullPak (Iso) package
HEXFET? Power MOSFET

File Size 103.68K  /  8 Page

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    DBCTB92-2 DBCTB92-3 DBCTB93-2 DBCTB93-3 DBCTB75-2 DBCTB75-3 DBCTB91-2 DBCTB91-3 DBCTB94-2 DBCTB94-3

Dubilier
Part No. DBCTB92-2 DBCTB92-3 DBCTB93-2 DBCTB93-3 DBCTB75-2 DBCTB75-3 DBCTB91-2 DBCTB91-3 DBCTB94-2 DBCTB94-3
OCR Text ...king temperature: Short Period: moulding: Pin/terminal: Spring: Recommended PCB hole size: 7.5/7.62/10/10.16 5/5.08 12A/750V 12/250V 3KV/60sec 2.5KV/60sec 5M -20C to 125C 160 UL94V-0 flame retardant PA66 5 tinned, phosphor bronze Zinc plate...
Description TERMINAL BLOCKS 5, 5.08, 7.5, 7.62, 10 AND 10.16mm SCREWLESS

File Size 91.11K  /  1 Page

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    MMP10470NJ MMP10470NJTA MMP10470NJTR MMP10470NK MMP10470NKTA MMP10470NKTR MMP25470NKTA MMP40470NKTA MMP25470NKTR MMP4047

Dubilier
Part No. MMP10470NJ MMP10470NJTA MMP10470NJTR MMP10470NK MMP10470NKTA MMP10470NKTR MMP25470NKTA MMP40470NKTA MMP25470NKTR MMP40470NKTR MMP25470NJTA MMP40470NJTA MMP25470NJ MMP25470NJTR MMP25470NK
OCR Text ...g is an insulated thermoplastic moulding incorporating stand-off lugs for easy removal of solder flux. Flame retardant case and resin in accordance with UL 94VO. 5mm BOX POLYESTER MMP SECTION 1 SPECIFICATION Temperature Range Capa...
Description CAPACITORS 5mm BOX POLYESTER MMP

File Size 193.60K  /  2 Page

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    Infineon Technologies
Part No. TLE4917
OCR Text ...ess to the Hall probe caused by moulding and soldering processes and other thermal stresses in the package. This chopper technique together with the threshold generator and the comparator ensures high accurate magnetic switching points. Ver...
Description Hall-Effect Switch

File Size 235.71K  /  13 Page

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    IRFI9520N

International Rectifier
Part No. IRFI9520N
OCR Text ...al-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO...
Description HEXFET? Power MOSFET

File Size 99.36K  /  8 Page

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    IIC10-14 IIC10P-14-3C30 IIC10P-14-3F35 IIC10P-14-3F4

Ferroxcube International Holding B.V.
Part No. IIC10-14 IIC10P-14-3C30 IIC10P-14-3F35 IIC10P-14-3F4
OCR Text ...AL DATA ITEM Leadframe material moulding material Solderability Taping method Rdc 65 m (25 C) and 85 m (100 C) for 10 turns including 20 solder joints (assuming 70 m Cu PCB tracks). Isolation voltage >500 V (DC) between leads and between ...
Description Integrated inductive components

File Size 86.77K  /  9 Page

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    IRFI9Z34N IRFI840G IRFI9Z34NPBF

IRF[International Rectifier]
Part No. IRFI9Z34N IRFI840G IRFI9Z34NPBF
OCR Text ...al-industrial applications. The moulding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO...
Description -55V Single P-Channel HEXFET Power MOSFET in a TO-220 FullPak (Iso) package
HEXFET? Power MOSFET
HEXFET Power MOSFET (-55V, 0.1ohm, -14A)

File Size 113.95K  /  8 Page

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    IIC2-14 IIC2P-14-3F35-E

Ferroxcube International Holding B.V.
Part No. IIC2-14 IIC2P-14-3F35-E
OCR Text ...AL DATA ITEM Leadframe material moulding material Solderability Taping method Rdc 110 per turn at 10 A Isolation voltage > 500 V (DC) between leads and between leads and ferrite core. Isolation resistance >100 M between leads. SPECIFICATI...
Description Integrated inductive components

File Size 65.63K  /  7 Page

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    NTFS0512MC NTFS0515MC NTFS0505MC KDCNTF

Murata Manufacturing Co., Ltd.
Part No. NTFS0512MC NTFS0515MC NTFS0505MC KDCNTF
OCR Text ...adframe technology and transfer moulding techniques to bring all of the benefits of IC style packaging to hybrid circuitry. Co-planarity of the lead positions is based upon IEC 191-6:1990. The devices are suitable for all applications where...
Description Isolated 1W Wide Input DC/DC Converters

File Size 168.77K  /  8 Page

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For moulding Found Datasheets File :: 308    Search Time::6.172ms    
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