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For vias Found Datasheets File :: 6518 Search Time::1.203ms
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				TE Connectivity, Ltd. ICST[Integrated Circuit Systems]
Part No.	MK3805 MK3805RI MK3805RIT
OCR Text	...to the VDD pins as possible. No vias should be used between the decoupling capacitors and VDD pins. The PCB trace to VDD pin should be kept as short as possible, as should the PCB trace to the ground via. 2) To minimize EMI, the 33 series t...
Description	Buffer/Clock Driver 缓冲时钟驱动 1:10 Low Skew Clock Driver/Buffer
File Size	74.95K / 6 Page	View it Online	Download Datasheet

				Integrated Device Techn...
Part No.	IDT5V41236
OCR Text	...to the vdd pin as possible. no vias should be used between decoupling capacitor and vdd pin. the pcb trace to vdd pin should be kept as short as possible, as should the pcb trace to the ground via. distance of the ferrite bead and bulk ...
Description	4 OUTPUT PCIE GEN1/2/3 SYNTHESIZER
File Size	319.35K / 18 Page	View it Online	Download Datasheet

				Integrated Device Techn...
Part No.	IDT5V41065
OCR Text	...s possible. do not share ground vias between components. route power from power source through the capacitor pad and then into ics pin. crystal a 25 mhz fundamental mode parallel resonant crystal should be used. this crystal must have l...
Description	2 OUTPUT PCIE GEN1/2 SYNTHESIZER
File Size	305.98K / 18 Page	View it Online	Download Datasheet

				United Monolithic Semiconductors
Part No.	CHX2090-QDG
OCR Text	...a grid of plenty plated through vias with a diameter of less than 300m [12 mils] and a spacing of less than 700m [28 mils] from the centres of two adjacent vias. The via grid should cover the whole space under the ground pad and the vias cl...
Description	12-24GHz Frequency Multiplier
File Size	319.74K / 10 Page	View it Online	Download Datasheet

				TriQuint Semiconductor
Part No.	HFET2MI
OCR Text	...al layers Air bridges Substrate vias Operation up to Vd = 10 V Up to 20 GHz Communications Space Military Power amplifiers Driver amplifiers AGC amplifiers Limiting amplifiers Transimpedance amplifiers Differential amplifiers VIA UNDER C...
Description	0.5-μm HFET 2MI 0.5-レm HFET 2MI
File Size	309.44K / 6 Page	View it Online	Download Datasheet

				RF Micro Devices
Part No.	RF2173PCBA-41X RF21731
OCR Text	...ity that this pin have it's own vias to the ground plane, minimizing common inductance. RF Input. This is a 50 input, but the actual impedance depends on the interstage matching network connected to pin 5. An external DC blocking capacitor ...
Description	3V GSM POWER AMPLIFIER
File Size	276.53K / 14 Page	View it Online	Download Datasheet

				RF Micro Devices
Part No.	RF21741
OCR Text	...lity that this pin has it's own vias to the groundplane, to minimize any common inductance. Power supply for the pre-amplifier stage and interstage matching. This pin See pin 3. forms the shunt inductance needed for proper tuning of the int...
Description	3V DCS POWER AMPLIFIER
File Size	317.95K / 16 Page	View it Online	Download Datasheet

				http:// Integrated Device Technology
Part No.	ICS251PMLF ICS251 ICS251M-XX ICS251M-XXLF ICS251M-XXLFT ICS251M-XXT ICS251MI-XX ICS251MI-XXLF ICS251MI-XXLFT ICS251MI-XXT ICS251PM ICS251PMI ICS251PMILF
OCR Text	...g very short PCB traces (and no vias) been the crystal and device. Crystal capacitors must be connected from each of the pins X1 and X2 to ground. The value (in pF) of these crystal caps should equal (CL -6 pF)*2. In this equation, CL= crys...
Description	FIELD PROGRAMMABLE SS VERSACLOCK SYNTHESIZER
File Size	151.65K / 10 Page	View it Online	Download Datasheet

For vias Found Datasheets File :: 6518 Search Time::1.203ms
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