001008-1089 pdf Datasheet P14 Part Num --- IC-ON-LINE

Renesas Electronics Corporation

Part No.

HAT1089C-EL-E

Description

Pch Single Power Mosfet -20V -2A 103Mohm Cmfpak6

Tech specs

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001008-1089 Datasheet PDF File

For 001008-1089 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |

				Molex Electronics Ltd.
Part No.	0010897240 010-89-7240
Description	2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 24 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Pl 2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107) PC Tail
File Size	421.78K / 4 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0510892805 51089-2805
Description	2.00mm (.079) Pitch Mi II System Wire-to-Board Crimp Housing, Dual Row, 28Circuits
File Size	92.73K / 2 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0510892405 51089-2405
Description	2.00mm (.079) Pitch Mi II System Wire-to-Board Crimp Housing, Dual Row, 24Circuits 2.00mm (.079) Pitch Mi II?/a> System Wire-to-Board Crimp Housing, Dual Row, 24Circuits
File Size	92.74K / 2 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0510892205 51089-2205
Description	2.00mm (.079) Pitch Mi II System Wire-to-Board Crimp Housing, Dual Row, 22 Circuits
File Size	92.74K / 2 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0510893405 51089-3405
Description	2.00mm (.079) Pitch Mi II System Wire-to-Board Crimp Housing, Dual Row, 34Circuits 2.00mm (.079") Pitch Mi II垄芒 System Wire-to-Board Crimp Housing, Dual Row, 34Circuits
File Size	92.74K / 2 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0510893005 51089-3005
Description	2.00mm (.079) Pitch Mi II System Wire-to-Board Crimp Housing, Dual Row, 30Circuits 2.00mm (.079") Pitch Mi II垄芒 System Wire-to-Board Crimp Housing, Dual Row, 30Circuits
File Size	92.74K / 2 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0010897160 010-89-7160
Description	2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row, Vertical, High Temperature, 16 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selective Plating
File Size	421.90K / 4 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0510895005 51089-5005
Description	2.00mm (.079) Pitch Mi II System Wire-to-Board Crimp Housing, Dual Row, 50Circuits 2.00mm (.079") Pitch Mi II垄芒 System Wire-to-Board Crimp Housing, Dual Row, 50Circuits 2.00mm (.079) Pitch Mi II?/a> System Wire-to-Board Crimp Housing, Dual Row, 50Circuits
File Size	92.74K / 2 Page	View it Online	Download Datasheet

For 001008-1089 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |