|
|
|
Renesas Electronics Corporation |
Part No. |
HI5762/6INZ
|
Description |
Dual 10-Bit, 60MSPS A/D Converter with CMOS Outputs, MQFP, /Tray
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Renesas Electronics Corporation |
Part No. |
UPD48576236F1-E24-DW1-A
|
Description |
576M-BIT Low Latency DRAM Common I/O
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Renesas Electronics Corporation |
Part No. |
UPD48576218F1-E24-DW1-A
|
Description |
576M-BIT Low Latency DRAM Common I/O
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Renesas Electronics Corporation |
Part No. |
UPD48576236FF-E24-DW1-A
|
Description |
Low Latency DRAM, T-TFBGA, /Tray
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Renesas Electronics Corporation |
Part No. |
UPD48576236F1-E18-DW1-A
|
Description |
576M-BIT Low Latency DRAM Common I/O
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Renesas Electronics Corporation |
Part No. |
UPD48576209F1-E24-DW1-A
|
Description |
576M-BIT Low Latency DRAM Common I/O
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Molex Electronics Ltd.
|
Part No. |
75757-6231 0757576231
|
Description |
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
|
File Size |
166.28K /
4 Page |
View
it Online |
Download Datasheet |
|
|
|
Renesas Electronics Corporation |
Part No. |
UPD48576218F1-E18-DW1-A
|
Description |
576M-BIT Low Latency DRAM Common I/O
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Molex Electronics Ltd.
|
Part No. |
0757576281 75757-6281
|
Description |
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 1.25渭m (50渭) Nickel (Ni) Overall, 2.50渭m (100渭) Minimum Select Matte Tin (Sn) Plating on Ta 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
|
File Size |
166.28K /
4 Page |
View
it Online |
Download Datasheet |
|
|
|
Renesas Electronics Corporation |
Part No. |
HI5762/6IN
|
Description |
Dual 10-Bit, 60MSPS A/D Converter with CMOS Outputs, MQFP, /Tray
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Molex Electronics Ltd.
|
Part No. |
75757-6261 0757576261
|
Description |
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, 1.25μm(50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 1.25μm(50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on
|
File Size |
166.28K /
4 Page |
View
it Online |
Download Datasheet |
|
Bom2Buy.com
Price and Availability
|