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  272917-003 Datasheet PDF File

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    22-28-0036

Molex Electronics Ltd.
Part No. 22-28-0036
Description KK? 254 Breakaway Header, Vertical, with Friction Lock, 3 Circuits, Tin (Sn) Plating, with Back walls Removed

File Size 66.24K  /  2 Page

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HUA FENG CIRCUIT





    MULTI CONTACT AG
Part No. 15.0033-20
Description INTERCONNECTION DEVICE

File Size 92.21K  /  2 Page

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    22-28-0037

Molex Electronics Ltd.
Part No. 22-28-0037
Description KK? 254 Breakaway Header, Vertical, with Friction Lock, 3 Circuits, 0.38μm Gold (Au) Selective Plating, with Backwalls Removed

File Size 66.26K  /  2 Page

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    22-28-0030

Molex Electronics Ltd.
Part No. 22-28-0030
Description KK? 254 Breakaway Header, Vertical, with Friction Lock, 3 Circuits, Tin (Sn) Plating

File Size 66.19K  /  2 Page

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    Molex, Inc.
Part No. 39-00-0038
Description Crimp Socket Contact; Wire Size (AWG):18-24; Contact Material:Brass; Contact Plating:Tin; Contact Termination:Crimp BRASS, TIN OVER COPPER FINISH, WIRE TERMINAL

File Size 163.11K  /  3 Page

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    CG-BGA-5003

Ironwood Electronics.
Part No. CG-BGA-5003
Description Minimum real estate required

File Size 75.62K  /  4 Page

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    CG-BGA-4003

Ironwood Electronics.
Part No. CG-BGA-4003
Description Directly mounts to target PCB with hardware

File Size 112.47K  /  4 Page

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    HMC-C003

Hittite Microwave Corporation
Part No. HMC-C003
Description WIDEBAND POWER AMPLIFIER MODULE, 2 - 20 GHz

File Size 492.41K  /  4 Page

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    CGM-18-6003

Teledyne Technologies Incorporated
Part No. CGM-18-6003
Description Module Amplifier 6 GHz - 18 GHz

File Size 903.33K  /  2 Page

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    Bel Fuse, Inc.
Part No. USI-6003
Description ASIC 专用集成电路

File Size 1,054.12K  /  20 Page

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