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4N29A IRG4P SMD1812 QB0303XT SK38SMA PS4652 331MP 2SA1744L
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  325mm Datasheet PDF File

For 325mm Found Datasheets File :: 217    Search Time::1.313ms    
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    ULC0404FC12C-T75-1 ULC0404FC24C-T75-1 ULC0404FC05C-LF-T75-1 ULC0404FC05C-LF-T710-2

PROTEK DEVICES
Part No. ULC0404FC12C-T75-1 ULC0404FC24C-T75-1 ULC0404FC05C-LF-T75-1 ULC0404FC05C-LF-T710-2
OCR Text ... non-solder mask defined pads 0.325mm round 0.150mm 0.330mm round no clean osp(entek cu plus 106a) 50m 20m 60 seconds 270c pad size on pcb pad shape pad definition solder mask opening solder stencil thickness solder stencil aperture opening...
Description 200 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE

File Size 72.29K  /  6 Page

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    P0404FC24C-LF-T710-2

ProTek Devices
Part No. P0404FC24C-LF-T710-2
OCR Text ... non-solder mask defined pads 0.325mm round 0.150mm 0.330mm round no clean osp(entek cu plus 106a) 50m 20m 60 seconds 270c pad size on pcb pad shape pad definition solder mask opening solder stencil thickness solder stencil aperture opening...
Description 250 W, BIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE ROHS COMPLIANT, FLIP CHIP-4

File Size 76.55K  /  6 Page

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    SFC05-5-LF-T75-2

ProTek Devices
Part No. SFC05-5-LF-T75-2
OCR Text ... non-solder mask defined pads 0.325mm round 0.150mm 0.330mm round no clean osp(entek cu plus 106a) 50m 20m 60 seconds 270c pad size on pcb pad shape pad definition solder mask opening solder stencil thickness solder stencil aperture opening...
Description FLIP CHIP ARRAY 250 W, BIDIRECTIONAL, 5 ELEMENT, SILICON, TVS DIODE

File Size 88.37K  /  6 Page

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    ULC0402FC3.3C11 ULC0402FC08C ULC0402FC12C ULC0402FC05C ULC0402FC24C ULC0402FC15C ULC0402FC36C

Protek Devices
Part No. ULC0402FC3.3C11 ULC0402FC08C ULC0402FC12C ULC0402FC05C ULC0402FC24C ULC0402FC15C ULC0402FC36C
OCR Text ...fned pads solder mask opening 0.325mm round solder stencil thickness 0.150mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.330mm round solder paste type no clean pad protectve finish osp (entek cu plus 106a) tolerance - ed...
Description 200W LOW CAPACITANCE unbumpe d flip chip tvs array

File Size 459.91K  /  8 Page

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    California Micro Devices
Part No. CSPESD303 CSPESD302 CSPESD301
OCR Text ... Non-Solder Mask defined pads 0.325mm Round 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 240C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask ...
Description "1, 2 and 3-channel ESD Arrays in Chip Scale Package "

File Size 157.09K  /  6 Page

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    LC0402FC24C LC0402FC05C LC0402FC08C LC0402FC12C LC0402FC15C LC0402FC3.3C LC0402FC36C

Protek Devices
Part No. LC0402FC24C LC0402FC05C LC0402FC08C LC0402FC12C LC0402FC15C LC0402FC3.3C LC0402FC36C
OCR Text ...fned pads solder mask opening 0.325mm round solder stencil thickness 0.150mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.330mm round solder paste type no clean pad protectve finish osp (entek cu plus 106a) tolerance - ed...
Description 200W LOW CAPACITANCE flip chip tvs array

File Size 555.86K  /  9 Page

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    ULL0402FC05C12

Protek Devices
Part No. ULL0402FC05C12
OCR Text ...fned pads solder mask opening 0.325mm round solder stencil thickness 0.150mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.330mm round solder paste type no clean pad protectve finish osp (entek cu plus 106a) tolerance - ed...
Description LOW CAPACITANCE UNBUMPED FLIP CHIP TVS ARRAY

File Size 374.60K  /  7 Page

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    ULL0402FC05C

Protek Devices
Part No. ULL0402FC05C
OCR Text ...fned pads solder mask opening 0.325mm round solder stencil thickness 0.150mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.330mm round solder paste type no clean pad protectve finish osp (entek cu plus 106a) tolerance - ed...
Description LOW CAPACITANCE unbumped flip chip tvs array

File Size 373.46K  /  7 Page

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For 325mm Found Datasheets File :: 217    Search Time::1.313ms    
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