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Integrated Device Techn...
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| Part No. |
89HPES10T4G2
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| OCR Text |
...kaged in a 19mm x 19mm 324-ball bga with 1mm ball spacing product description utilizing standard pci express interconnect, the pes10t4g2 provides the most efficient fan-out solution for applications requiring high throughput, low latency,... |
| Description |
One virtual channel
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| File Size |
244.27K /
30 Page |
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Integrated Device Techn...
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| Part No. |
89HPES4T4G2
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| OCR Text |
...aged in a 19mm x 19mm, 324-ball bga with 1mm ball spacing product description utilizing standard pci express interconnect the pes4t4g2 provides the most efficient high-performance i/o connectivity device for applica- tions requiring high ... |
| Description |
Support for Max Payload Size up to 2Kbytes
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| File Size |
420.92K /
30 Page |
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Integrated Device Techn...
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| Part No. |
89HPES12N3
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| OCR Text |
...s packaged in 19x19mm 324 ball bga with 1mm ball spacing product description utilizing standard pci express interconnect, the pes12n3 provides the most efficient high-performance i/o connectivity solution for applica- tions requiring high... |
| Description |
Supports one virtual channel
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| File Size |
271.25K /
28 Page |
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it Online |
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Integrated Device Techn...
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| Part No. |
89HPES12NT12G2
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| OCR Text |
...19mm x 19mm 324- ball flip chip bga with 1mm ball spacing product description with non-transparent bridging f unctionality and innovative switch partitioning feature, the pes12nt12g 2 allows true multi-host or multi- processor communicati... |
| Description |
Low latency cut-through architecture
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| File Size |
243.85K /
32 Page |
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it Online |
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Integrated Device Techn...
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| Part No. |
89HPES16NT16G2
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| OCR Text |
...19mm x 19mm 324- ball flip chip bga with 1mm ball spacing product description with non-transparent bridging f unctionality and innovative switch partitioning feature, the pes16nt16g 2 allows true multi-host or multi- processor communicati... |
| Description |
Supports 128 Bytes to 2 KB maximum payload size
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| File Size |
244.50K /
33 Page |
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it Online |
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Integrated Device Techn...
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| Part No. |
89HPES16T4AG2
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| OCR Text |
...19mm x 19mm, 324-ball flip chip bga with 1mm ball spacing product description utilizing standard pci express interconnect, the pes16t4ag2 provides the most efficient fan-out solution for applications requiring high throughput, low latenc... |
| Description |
Low latency cut-through switch architecture
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| File Size |
273.47K /
32 Page |
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it Online |
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Integrated Device Techn...
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| Part No. |
89HPES24NT24G2
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| OCR Text |
...19mm x 19mm 324- ball flip chip bga with 1mm ball spacing product description with non-transparent bridging f unctionality and innovative switch partitioning feature, the pes24nt24g 2 allows true multi-host or multi- processor communicati... |
| Description |
Supports 128 Bytes to 2 KB maximum payload size
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| File Size |
248.26K /
35 Page |
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it Online |
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Integrated Device Techn...
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| Part No. |
89HPES24T6G2
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| OCR Text |
...19mm x 19m m 324-ball flip chip bga with 1mm ball spacing ? option b package: 27mm x 27m m 676-ball flip chip bga with 1mm ball spacing product description utilizing standard pci express interconnect, the pes24t6g2 provides the most effic... |
| Description |
Support for Max Payload Size up to 2048 bytes
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| File Size |
586.14K /
54 Page |
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it Online |
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Price and Availability
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