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  bga-324 Datasheet PDF File

For bga-324 Found Datasheets File :: 139    Search Time::1.75ms    
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    Integrated Device Techn...
Part No. 89HPES10T4G2
OCR Text ...kaged in a 19mm x 19mm 324-ball bga with 1mm ball spacing product description utilizing standard pci express interconnect, the pes10t4g2 provides the most efficient fan-out solution for applications requiring high throughput, low latency,...
Description One virtual channel

File Size 244.27K  /  30 Page

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    Integrated Device Techn...
Part No. 89HPES4T4G2
OCR Text ...aged in a 19mm x 19mm, 324-ball bga with 1mm ball spacing product description utilizing standard pci express interconnect the pes4t4g2 provides the most efficient high-performance i/o connectivity device for applica- tions requiring high ...
Description Support for Max Payload Size up to 2Kbytes

File Size 420.92K  /  30 Page

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    Integrated Device Techn...
Part No. 89HPES12N3
OCR Text ...s packaged in 19x19mm 324 ball bga with 1mm ball spacing product description utilizing standard pci express interconnect, the pes12n3 provides the most efficient high-performance i/o connectivity solution for applica- tions requiring high...
Description Supports one virtual channel

File Size 271.25K  /  28 Page

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    Integrated Device Techn...
Part No. 89HPES12NT12G2
OCR Text ...19mm x 19mm 324- ball flip chip bga with 1mm ball spacing product description with non-transparent bridging f unctionality and innovative switch partitioning feature, the pes12nt12g 2 allows true multi-host or multi- processor communicati...
Description Low latency cut-through architecture

File Size 243.85K  /  32 Page

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    Integrated Device Techn...
Part No. 89HPES16NT16G2
OCR Text ...19mm x 19mm 324- ball flip chip bga with 1mm ball spacing product description with non-transparent bridging f unctionality and innovative switch partitioning feature, the pes16nt16g 2 allows true multi-host or multi- processor communicati...
Description Supports 128 Bytes to 2 KB maximum payload size

File Size 244.50K  /  33 Page

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    Integrated Device Techn...
Part No. 89HPES16T4AG2
OCR Text ...19mm x 19mm, 324-ball flip chip bga with 1mm ball spacing product description utilizing standard pci express interconnect, the pes16t4ag2 provides the most efficient fan-out solution for applications requiring high throughput, low latenc...
Description Low latency cut-through switch architecture

File Size 273.47K  /  32 Page

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    Integrated Device Techn...
Part No. 89HPES24NT24G2
OCR Text ...19mm x 19mm 324- ball flip chip bga with 1mm ball spacing product description with non-transparent bridging f unctionality and innovative switch partitioning feature, the pes24nt24g 2 allows true multi-host or multi- processor communicati...
Description Supports 128 Bytes to 2 KB maximum payload size

File Size 248.26K  /  35 Page

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    Integrated Device Techn...
Part No. 89HPES24T6G2
OCR Text ...19mm x 19m m 324-ball flip chip bga with 1mm ball spacing ? option b package: 27mm x 27m m 676-ball flip chip bga with 1mm ball spacing product description utilizing standard pci express interconnect, the pes24t6g2 provides the most effic...
Description Support for Max Payload Size up to 2048 bytes

File Size 586.14K  /  54 Page

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Price and Availability




 
Price & Availability of bga-324
DigiKey

Part # Manufacturer Description Price BuyNow  Qty.
CCGM1A1-BGA324
4158-CCGM1A1-BGA324-ND
Cologne Chip GateMate FPGA CCGM1A1, 324 BGA 119: USD16.88723
25: USD18.8872
10: USD19.776
1: USD21.44
BuyNow
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