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  chipfet Datasheet PDF File

For chipfet Found Datasheets File :: 176    Search Time::1.266ms    
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    SI5935DC SI5935DC-T1

Vishay Siliconix
Part No. SI5935DC SI5935DC-T1
OCR Text ...ability Manual for profile. The chipfet is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guarante...
Description Dual P-Channel 1.8-V (G-S) MOSFET

File Size 69.90K  /  5 Page

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    SI5461EDC SI5461EDC-T1

Vishay Siliconix
Part No. SI5461EDC SI5461EDC-T1
OCR Text ...ability Manual for profile. The chipfet is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guarante...
Description P-Channel 20-V (D-S) MOSFET

File Size 90.58K  /  5 Page

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    NTLJF3118N NTHD3100F NTMSD6N303 NTHD4N02 NTHD4P02 NTLJF3117P NTLJF3117P_1 NTLJF4156N NTMSD3P102 NTMSD3P303

ONSEMI[ON Semiconductor]
Part No. NTLJF3118N NTHD3100F NTMSD6N303 NTHD4N02 NTHD4P02 NTLJF3117P NTLJF3117P_1 NTLJF4156N NTMSD3P102 NTMSD3P303
OCR Text ...ark of International Rectifier. chipfet is a trademark of Vishay Siliconix. ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without ...
Description Typical Uses for FETKY Devices

File Size 211.82K  /  2 Page

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    VISAY[Vishay Siliconix]
Part No. SI5449DC-T1 SI5449DC
OCR Text ...ability Manual for profile. The chipfet is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guarante...
Description P-Channel 30-V (D-S) MOSFET

File Size 106.38K  /  4 Page

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    KTHC5513

Guangdong Kexin Industrial Co.,Ltd
Part No. KTHC5513
OCR Text ...lementary Pair Low RDS(on) in a chipfet Package for High Efficiency Performance Low Profile ( 1.10 mm) Allows Placement in Extremely Thin Environments Such as Portable Electronics Absolute Maximum Ratings Ta = 25 Parameter Drain-sour...
Description Power MOSFET

File Size 69.53K  /  3 Page

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    SI5401DC SI5401DC-T1-E3

VISAY[Vishay Siliconix]
Part No. SI5401DC SI5401DC-T1-E3
OCR Text ...ability Manual for profile. The chipfet is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guarante...
Description P-Channel 20-V (D-S) MOSFET

File Size 62.96K  /  5 Page

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    SI5856DC

Vishay Intertechnology,Inc.
Vishay Siliconix
Part No. SI5856DC
OCR Text ...ability Manual for profile. The chipfet is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guarante...
Description N-Channel 1.8-V (G-S) MOSFET With Schottky Diode

File Size 81.66K  /  6 Page

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    SI5509DC SI5509DC08

Vishay Siliconix
Part No. SI5509DC SI5509DC08
OCR Text ...ability Manual for profile. The chipfet is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guarante...
Description N- and P-Channel 20-V (D-S) MOSFET

File Size 130.91K  /  12 Page

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    SI5463EDC08 SI5463EDC-T1

http://
Vishay Siliconix
Part No. SI5463EDC08 SI5463EDC-T1
OCR Text ...ability Manual for profile. The chipfet is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guarante...
Description P-Channel 20-V (D-S) MOSFET

File Size 136.88K  /  6 Page

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    SI5441BDC SI5441BDC-T1-E3

Vishay Siliconix
Part No. SI5441BDC SI5441BDC-T1-E3
OCR Text ...ability Manual for profile. The chipfet is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guarante...
Description P-Channel 2.5-V (G-S) MOSFET

File Size 90.41K  /  6 Page

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For chipfet Found Datasheets File :: 176    Search Time::1.266ms    
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