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Integrated Device Techn...
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| Part No. |
843022AKI-02LF 843022AKI-02LFT
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| OCR Text |
...hrough a solder joint, thermal vias are necessary to effectively conduct from the surface of the pcb to the ground plane(s). the land pattern must be connected to ground through these vias. the vias act as ?heat pipes?. the number of vi... |
| Description |
FemtoClock? Crystal-to-3.3V, 2.5V LVPECL Clock Generator
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| File Size |
530.90K /
17 Page |
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it Online |
Download Datasheet
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Pericom Semiconductor C...
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| Part No. |
PI6C4911506LIE
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| OCR Text |
... 3 4 5 6 vdd gnd keep out board vias vcc gnd 150 150 156.25m xo 0.1uf *100 *100 is optional if ic has gnd fig 2: ic routing for xo drive clock ic device vdd 11 13 10 9 8 12 14 0.1uf 0.1uf gnd gnd vdd vdd decouple cap. on comp. side gnd ... |
| Description |
6 Output High Performance LVPECL Fanout Buffer
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| File Size |
955.82K /
14 Page |
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it Online |
Download Datasheet |
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Pericom Semiconductor C...
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| Part No. |
PI6C4911505-07LIEX
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| OCR Text |
... 3 4 5 6 vdd gnd keep out board vias vcc gnd 150 150 156.25m xo 0.1uf *100 *100 is optional if ic has gnd ic routing for xo drive clock ic device vdd 11 13 10 9 8 12 14 0.1uf 0.1uf gnd gnd vdd vdd decouple cap. on comp. side gnd clock t... |
| Description |
High Performance 1:5 LVPECL Fanout Buffer
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| File Size |
957.23K /
12 Page |
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it Online |
Download Datasheet |
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Price and Availability
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