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  43045-0819 Datasheet PDF File

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    0430450429-18

Molex Electronics Ltd.
Part No. 0430450429-18
Description Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Dual Row, 4 Circuits
File Size 27.84K  /  2 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0430450821-18

Molex Electronics Ltd.
Part No. 0430450821-18
Description Micro-Fit 3.0 Right Angle Header, 3.00mm Pitch, Dual Row, 8 Circuits
File Size 30.31K  /  2 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

Official Product Page

    0430450801-18

Molex Electronics Ltd.
Part No. 0430450801-18
Description Micro-Fit 3.0 Right Angle Header, 3.00mm Pitch, Dual Row, 8 Circuits
File Size 29.91K  /  2 Page

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Renesas Electronics Corporation
Part No. RJK0819DSP-00#J0
Description Nch Dual Power Mosfet 80V 2.4A 175Mohm Sop8
Tech specs 　 　

Official Product Page

    0430452428-18

Molex Electronics Ltd.
Part No. 0430452428-18
Description Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Dual Row, 24 Circuits
File Size 27.85K  /  2 Page

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Amphenol Communications Solutions
Part No. 54112-809081900LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 8 Positions
Tech specs 　 　

Official Product Page

    0430450620

Molex Electronics Ltd.
Part No. 0430450620
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 6 Circuits
File Size 175.81K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-811081900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0430451229

Molex Electronics Ltd.
Part No. 0430451229
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 12 Circuits
File Size 166.05K  /  3 Page

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Amphenol Communications Solutions
Part No. 54122-112081950LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    0430452426

Molex Electronics Ltd.
Part No. 0430452426
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 24 Circuits
File Size 182.76K  /  3 Page

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Amphenol Communications Solutions
Part No. 57102-F08-19LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 38 Positions - 2mm (0.079inch) - Vertical
Tech specs 　 　

Official Product Page

    43045-0811 0430450811

Molex Electronics Ltd.
Part No. 43045-0811 0430450811
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 8 Circuits
File Size 176.81K  /  3 Page

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Amphenol Communications Solutions
Part No. 57102-S08-19LF
Description Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions
Tech specs 　 　

Official Product Page

    43045-0812 0430450812

Molex Electronics Ltd.
Part No. 43045-0812 0430450812
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 8 Circuits
File Size 166.51K  /  3 Page

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    43045-0813 0430450813

Molex Electronics Ltd.
Part No. 43045-0813 0430450813
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 8 Circuits
File Size 166.54K  /  3 Page

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