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  90130-1316 Datasheet PDF File

For 90130-1316 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    0901303112

Molex Electronics Ltd.
Part No. 0901303112
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 12 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.44K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-6216-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901303114

Molex Electronics Ltd.
Part No. 0901303114
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 14 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.44K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-6518-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0901303118

Molex Electronics Ltd.
Part No. 0901303118
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 18 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-6314-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Left End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    90130-1144 0901301144

Molex Electronics Ltd.
Part No. 90130-1144 0901301144
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 44 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 586.01K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-6616-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    0901303350

Molex Electronics Ltd.
Part No. 0901303350
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 50 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 224.10K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-6318-21D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    2673901301

Fair-Rite Products Corp.
Part No. 2673901301
Description 73 SHIELD BEAD

File Size 514.80K  /  5 Page

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Amphenol Communications Solutions

Part No. 131-6114-21H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    0901303116

Molex Electronics Ltd.
Part No. 0901303116
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 16 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.44K  /  4 Page

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    0901303244 90130-3244

Molex Electronics Ltd.
Part No. 0901303244 90130-3244
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 44 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 44 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating

File Size 168.54K  /  4 Page

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    90130-1140 0901301140

Molex Electronics Ltd.
Part No. 90130-1140 0901301140
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 40 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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    0901303110

Molex Electronics Ltd.
Part No. 0901303110
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 10 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.44K  /  4 Page

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