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Amphenol Communications Solutions |
Part No. |
131-8318-11D
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Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Left End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
131-8114-11H
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Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
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Tech specs |
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Official Product Page
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![90130-1250 0901301250](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
90130-1250 0901301250
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 50 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 50 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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File Size |
586.12K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
131-8416-11H
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Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
131-8118-21D
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Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
131-8514-21D
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Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Left Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
131-8216-21H
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Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Double End Wall, Backplane Module, 2.25mm Wipe, APP.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
131-8518-21H
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Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Left Polarized, Backplane Module, 2.25mm Wipe, APP.
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Tech specs |
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Official Product Page
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![](images/bg04.gif) |
![90130-1222 0901301222](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
90130-1222 0901301222
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 22 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 22 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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File Size |
586.12K /
7 Page |
View
it Online |
Download Datasheet
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![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
131-8218-11D
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Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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Tech specs |
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Official Product Page
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![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
131-8614-11D
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Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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Tech specs |
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Official Product Page
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![90130-3320 0901303320](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
90130-3320 0901303320
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Description |
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 20 Circuits, Black 0.76楼矛m (30楼矛) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 20 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating
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File Size |
168.61K /
4 Page |
View
it Online |
Download Datasheet
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![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
131-8316-11H
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Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, APP.
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Tech specs |
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Official Product Page
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Bom2Buy.com
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Price and Availability
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