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Texas Instruments |
| Part No. |
F280038CPMQ1
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| Description |
Automotive C2000™ 32-bit MCU 120-MHz 384-KB flash, FPU, TMU with CLA, CLB, AES and CAN-FD 64-LQFP -40 to 125
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
F280038CPMRQ1
|
| Description |
Automotive C2000™ 32-bit MCU 120-MHz 384-KB flash, FPU, TMU with CLA, CLB, AES and CAN-FD 64-LQFP -40 to 125
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
F280038PMRQ1
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| Description |
Automotive C2000™ 32-bit MCU 120-MHz 384-KB flash, FPU, TMU with CLA, AES and CAN-FD 64-LQFP -40 to 125
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| Tech specs |
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Official Product Page
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Coilcraft Inc |
| Part No. |
DMT2-200-3.8L
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| Description |
General Purpose Inductor, 200uH, 1 Element, ROHS COMPLIANT
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87901-422HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87901-424HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 24 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87901-426HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 26 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0009070038 09-07-0038
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| Description |
3.96mm (.156") KK庐 IDT Double Cantilever Contact, 3 Circuits, Tin (Sn), Feed-To, 18 Solid or Fused Stranded, Yellow ID Strip
3.96mm (.156) KK? IDT Double Cantilever Contact, 3 Circuits, Tin (Sn), Feed-To, 18 Solid or Fused Stranded, Yellow ID Strip
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| File Size |
458.48K /
26 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
87901-420HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 20 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70545-0038 0705450038
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| Description |
2.54mm (.100) Pitch SL Header, Single Row .120 Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC
2.54mm (.100") Pitch SL垄芒 Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 4 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating
2.54mm (.100) Pitch SL?/a> Header, Single Row .120 Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC
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| File Size |
252.66K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68690-142HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 42 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87901-428HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 28 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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