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	Part Number	Hot Search : HN9C01FT 332I520 HTL295I M28F010 05SH3 MAX3861E 2SD1444A 0SMCJ22
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				Samsung Electronics Inc
Part No.	K9F1208U0M-YIB0 K9F1208U0M-YCB0
OCR Text	...connected to memory cell arrays accommodating data transfer between the I/O buffers and memory during page read and page program operations. The memory array is made up of 16 cells that are serially connected to form a NAND structure. Each ...
Description	EEPROM - Datasheet Reference From old datasheet system
File Size	522.24K / 40 Page	View it Online	Download Datasheet

				Samsung Electronics Inc SAMSUNG[Samsung semiconductor]
Part No.	K9S6408V0A-SSB0NBSP K9S6408V0A-SSB0 K9S6408V0A
OCR Text	...connected to memory cell arrays accommodating data transfer between the I/O buffers and memory during page read and page program operations. The memory array is made up of 16 cells that are serially connected to form a NAND structure. Each ...
Description	8M x 8Bit SmartMedia?Card Data sheet NAND Flash EEPROM From old datasheet system 8M x 8 Bit SmartMediaTM Card
File Size	345.62K / 26 Page	View it Online	Download Datasheet

				RFMD[RF Micro Devices]
Part No.	RF2513
OCR Text	...tage ranging from 2.2V to 5.0V, accommodating designs using three NiCd battery cells, two AAA flashlight cells, or a lithium button battery. The device is capable of providing up to 10mW output power into a 50 load (+10dBm) and is intended ...
Description	UHF TRANSMITTER
File Size	319.84K / 14 Page	View it Online	Download Datasheet

				SAMSUNG SEMICONDUCTOR CO. LTD. Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	K9S3208V0ANBSP K9S3208V0A-SSB0 K9S3208V0A
OCR Text	...connected to memory cell arrays accommodating data transfer between the I/O buffers and memory during page read and page program operations. The memory array is made up of 16 cells that are serially connected to form a NAND structure. Each ...
Description	4M x 8Bit SmartMedia Card Data Sheet 4M x 8 bit SmartMedia Card
File Size	341.41K / 26 Page	View it Online	Download Datasheet

				INTERPOINT[Interpoint Corporation Company]
Part No.	N150X4-L01
OCR Text	...These connectors are capable of accommodating the following signals and will be following components. Connector Name / Designation Manufacturer Type / Part Number Mating Receptacle/Part Number For Signal Connector JAE FI-XB30SL-HF10 FI-X30M...
Description	Engineering Specification Type 15.0 XGA Color TFT/LCD Module
File Size	128.79K / 29 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRL630S 2288 IRL630STRR IRL630STRL
OCR Text	... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The SMD-220 is suitable for high current applications...
Description	200V Single N-Channel HEXFET Power MOSFET in a D2-Pak package From old datasheet system HEXFET? Power MOSFET
File Size	173.42K / 8 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IRFZ34NSPBF IRFZ34NLPBF IRFZ34NS
OCR Text	... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications be...
Description	HEXFET Power MOSFET
File Size	291.37K / 10 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IRFZ34NS IRFZ34NL
OCR Text	... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2 Pak is suitable for high current applications b...
Description	HEXFET? Power MOSFET HEXFET Power MOSFET HEXFET㈢ Power MOSFET
File Size	136.33K / 10 Page	View it Online	Download Datasheet

For accommodating Found Datasheets File :: 725 Search Time::0.688ms
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