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Micross Components
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| Part No. |
HMC203
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| OCR Text |
...re. the mmic was connected to thin fi lm 50 ohm transmission lines with 1 mil diameter wirebonds of <10 mils in length. parameter min. typ. max. min. typ. max. units frequency range, rf & lo 14 - 23 15 - 21 ghz frequency range, if dc - 2... |
| Description |
Microwave Radio
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| File Size |
755.09K /
7 Page |
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Vishay Intertechnology, Inc.
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| Part No. |
SUM90P10-19L-E3
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| OCR Text |
...coplanarity max. 4 mils. 4. *: thin lead is for sub, syb. thick lead is for sum, sym, sqm. 5. use inches as the primary measurement. 6. t...pak: 3-lead 0.635 (16.129) recommended minimum pads dimensions in inches/(mm) 0.420 (10.668) 0.355... |
| Description |
17.2 A, 100 V, 0.019 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-263AB ROHS COMPLIANT, TO-263, 3 PIN
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| File Size |
180.63K /
8 Page |
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it Online |
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Micross Components
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| Part No. |
HMC361
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| OCR Text |
... the mounting surface so that a thin epoxy fi llet is observed around the perimeter of the chip once it is placed into position. cure epoxy per the manufacturers schedule. wire bonding ball or wedge bond with 0.025 mm (1 mil) diameter pur... |
| Description |
Wide Bandwidth
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| File Size |
842.32K /
9 Page |
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it Online |
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Micross Components
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| Part No. |
HMC392
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| OCR Text |
... the mounting surface so that a thin epoxy fi llet is observed around the perimeter of the chip once it is placed into position. cure epoxy per the manufacturers schedule. wire bonding ball or wedge bond with 0.025mm (1 mil) diameter pure... |
| Description |
Point-to-Point Radios
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| File Size |
841.92K /
9 Page |
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it Online |
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Microsemi
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| Part No. |
APT30GS60BRDQ2G APT30GS60SRDQ2G
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| OCR Text |
...erbolt hs ? series is based on thin wafer non-punch through (npt) technology similar to the thunderbolt ? series, but trades higher v ce(...pak apt30gs60brdq2(g) apt30gs60srdq2(g) 600v, 30a, v ce(on) = 2.8v typical apt30gs60brdq2(g) apt30... |
| Description |
IGBT w/ anti-parallel diode
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| File Size |
250.61K /
9 Page |
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it Online |
Download Datasheet |
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Price and Availability
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