...
b Hb W1 L H1 HO L1 S
d
wo W2 W
t
t1
P1
F1 DO
P2
ITEM DESCRI PTION base of P ackage to Le ad bend Componen Height t Lead Clinch He ight Component base Heig ht Componen Alignm t ent (s ide / side ) Componen Alignm t...
...D WE WF WG WH WI WJ WK WL WM WN wo
4. Short duration test pulse used to minimize self-heating effect. 5. f = 1kHz.
DS30502 Rev. 7 - 2
2 of 4 www.diodes.com
bZT52C2V0T - bZT52C24T
0.3
50
Tj = 25C
C2V7
C3V9
C5V6 ...
...
183
A
H1
H0 L
W2
wo W1 W
t1 t F1 F P2 Po F2 Do
Solderability Ensured
42
331
Flat Side of Transistor and Adhesive...b C D E F H C
DISTANCE bETWEEN OUTER LEADS COMPONENT ALIGNMENT TAPE WIDTH HOLD-DOWN TAPE WIDTH HO...
... bE L
FL AT SIDE 8.2"
W2
wo W1 W
t1
K
t
F1 F P2 Po
F2 Do
1 3"
1 .7 7"
D 3 E 2 1
ITEM
Flat S id e o f Tra ns...b C D E F G H K
MIN. 4.32 4.45 3.18 0.41 0.35
MAX. 5.33 5.20 4.19 0.55 0.50
FEED HO LE CENT...
Description
PNP COMPLEMENTARY SILICON HIGH VOLTAGE TRANSISTO<br>
...
A
183
H1
H0 L
W2
wo W1 W
L
t1
Solderability Ensured
t
F1 F P2 Po
F2
Do
beyond 'L'
2 3 D G AA
K
...b C D E F H C
321
PIN CONFIGURATION 1. bASE 2. COLLECTOR 3. EMITTER
G H K L
SPECIFICATIO...
... P Pd
b Ha H1 HO d L L1 W1 S wo W2 W
t
t1 P1 F1 P2 DO ITEM DESCRIPTION PO base of Package to Lead bend Component Height Lead Clinch Height Component base Height Component Alignment ( side/side ) Component Alignment ( front/back ) C...
... P Pd
b Ha H1 HO d L L1 W1 S wo W2 W
t
t1 P1 F1 P2 DO ITEM DESCRIPTION PO base of Package to Lead bend Component Height Lead Clinch Height Component base Height Component Alignment ( side/side ) Component Alignment ( front/back ) C...
...CHANICAL DATA
T P h A H1 W2 L
wo W1 W
Adhesive Tape on Top Side
(p)
D FEE
Carrier Strip
h
A1
LAbEL
FLAT SIDE
183
...b C D E F G H K L
DISTANCE bETWEEN OUTER LEADS COMPONENT ALIGNMENT TAPE WIDTH HOLD-DOWN TAPE WIDT...