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ZC829ATA SK208 10002 ON3131 BC848 FC142 02M96 LBN14081
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  0014-56-8081 Datasheet PDF File

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    AM80814-005

意法半导
STMicroelectronics
SGS Thomson Microelectronics
Part No. AM80814-005
Description RF & Microwave Transistors L-Band Radar Applications(用于L波段雷达脉冲驱动的RF和微波晶体管)
L-BAND RADAR APPLICATIONS RF & MICROWAVE TRANSISTORS
File Size 71.36K  /  5 Page

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Renesas Electronics Corporation
Part No. RAA2900014H12HPD
Description Intelligent Power Device, TO-252-3, /
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    AM80814-025

STMicroelectronics
SGS Thomson Microelectronics
Part No. AM80814-025
Description L-BAND RADAR APPLICATIONS RF & MICROWAVE TRANSISTORS
File Size 55.53K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-408081150LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    MicroWave Technology, Inc.
Part No. MPS-080817P-85
Description 806 MHz - 849 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER
File Size 98.75K  /  1 Page

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Amphenol Communications Solutions
Part No. 10131318-08111G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 8 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

Official Product Page

    NEC Corp.
Part No. PD78081A
Description 8 Bit Single Chip Microcontrollers(8位单片微控制
File Size 306.87K  /  60 Page

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Amphenol Communications Solutions
Part No. 54112-108081200LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    LV8081GQ

Sanyo Semicon Device
Part No. LV8081GQ
Description Two channels Constant-current H-bridge Driver
File Size 198.31K  /  9 Page

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Amphenol Communications Solutions
Part No. 54121-808101500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    TPCA8081

Toshiba Semiconductor
Part No. TPCA8081
Description Notebook PCs Mobile Handsets
File Size 234.32K  /  9 Page

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Amphenol Communications Solutions
Part No. 54121-108081650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    MARKTECH[Marktech Corporate]
Part No. MTE8081N
Description Infrared Emitter
File Size 46.36K  /  2 Page

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Amphenol Communications Solutions
Part No. 54121-808181000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 18 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    Renesas Electronics Corporation
Part No. PD78081A-15
Description 8-BIT SINGLE-CHIP MICROCONTROLLER
File Size 413.51K  /  62 Page

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Amphenol Communications Solutions
Part No. 83808-10010
Description Shield (Type I) closed end, with shield insulator
Tech specs 　 　

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    LP78081 LP78081-30B6F LP78081-33B6F

Lowpower Semiconductor inc
Part No. LP78081 LP78081-30B6F LP78081-33B6F
Description 600mA High Efficiency Synchronous Buck with 350mA LDO
File Size 377.57K  /  8 Page

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Amphenol Communications Solutions
Part No. 54122-108081300LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    Toshiba
Part No. TA8081P E003666
Description 0.7A MOTOR DRIVER WITH DIAGNOSIS
From old datasheet system
File Size 205.34K  /  6 Page

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Amphenol Communications Solutions
Part No. 59112-S38-08-124LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 16 Positions.
Tech specs 　 　

Official Product Page

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