00158 pdf Datasheet P2 Part Num --- IC-ON-LINE


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00158 Datasheet PDF File

For 00158 Found Datasheets File :: 140+ Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 |

					Molex Electronics Ltd.
Part No.	0014600158
Description	2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version D, Back Ribs, Wire Size 24, 3.81μm (150μ) Tin/Lead (SnPb)
File Size	159.55K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	87900-158HLF
Description	BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	15-80-0143 0015800143
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat Molex Electronics Ltd.
File Size	1,218.47K / 7 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	0015800163 15-80-0163
Description	2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size	1,218.30K / 7 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	0015800183
Description	MOLEX Connector
File Size	1,218.47K / 7 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	15-80-0123 0015800123
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat Molex Electronics Ltd.
File Size	1,218.43K / 7 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	0015800663
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size	1,218.29K / 7 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	15-80-0323 0015800323
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size	1,218.30K / 7 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	15-80-0401 0015800401
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating
File Size	1,218.27K / 7 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	15-80-0505 0015800505
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size	1,218.25K / 7 Page	View it Online	Download Datasheet

					Molex Electronics Ltd.
Part No.	15-80-0305 0015800305
Description	2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size	1,218.24K / 7 Page	View it Online	Download Datasheet

For 00158 Found Datasheets File :: 140+ Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 |

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