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  15111 Datasheet PDF File

For 15111 Found Datasheets File :: 70+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 |   

    1511194014

Molex Electronics Ltd.
Part No. 1511194014
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. L17TF1511101
Description Dsub, Stamped Signal 3A, Straight PCB Press-Fit, 15 Pin, Bright Tin Shell+Grounding Dimples, 0.38um (15 in) Gold, 4-40 Threaded Rear Insert, Without Boardlock
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    1511194012

Molex Electronics Ltd.
Part No. 1511194012
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 10155242-15111LF
Description Minitek® 1.25mm Latch,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 15 Position., Top Latch, Tin (preplated)
Tech specs    

Official Product Page

    1511175014

Molex Electronics Ltd.
Part No. 1511175014
Description    2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Vertical, 2.00μm Tin (Sn)

File Size 46.99K  /  2 Page

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Amphenol Communications Solutions

Part No. 108-1511-101
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, Guide Module, With Post, Ground Contact, No Key.
Tech specs    

Official Product Page

    1511193006

Molex Electronics Ltd.
Part No. 1511193006
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin Plating

File Size 51.53K  /  2 Page

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Amphenol Communications Solutions

Part No. L17TF1511114
Description Dsub, Stamped Signal 3A, Straight PCB Press-Fit, 15 Pin, Bright Tin Shell+Grounding Dimples, 0.38um (15 in) Gold, M3 Threaded Boardlock
Tech specs    

Official Product Page

    1511173410

Molex Electronics Ltd.
Part No. 1511173410
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Vertical, 2.00m Tin

File Size 46.99K  /  2 Page

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Amphenol Communications Solutions

Part No. 108-1511-100
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, Guide Module, With Post, No Key.
Tech specs    

Official Product Page

    1511175062

Molex Electronics Ltd.
Part No. 1511175062
Description    2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Vertical, 2.00μm Tin (Sn) Plating

File Size 46.99K  /  2 Page

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Amphenol Communications Solutions

Part No. 10155244-15111LF
Description Minitek® 1.25mm Latch,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 15 Position., Top Latch, Tin (preplated)
Tech specs    

Official Product Page

    1511175004

Molex Electronics Ltd.
Part No. 1511175004
Description    2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Vertical, 2.00μm Tin (Sn) Plating

File Size 46.98K  /  2 Page

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Amphenol Communications Solutions

Part No. 68015-111HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 11 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1511175066

Molex Electronics Ltd.
Part No. 1511175066
Description    2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Vertical, 2.00μm Tin (Sn) Plating

File Size 46.99K  /  2 Page

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Amphenol Communications Solutions

Part No. L17TF1511115
Description Dsub, Stamped Signal 3A, Straight PCB Press-Fit, 15 Pin, Bright Tin Shell+Grounding Dimples, 0.38um (15 in) Gold, M3 Threaded Boardlock with M3 Front Screwlock Installed
Tech specs    

Official Product Page

    1511175010

Molex Electronics Ltd.
Part No. 1511175010
Description    2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Vertical, 2.00μm Tin (Sn)

File Size 46.99K  /  2 Page

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Amphenol Communications Solutions

Part No. L17TF1511112
Description Dsub, Stamped Signal 3A, Straight PCB Press-Fit, 15 Pin, Bright Tin Shell+Grounding Dimples, 0.38um (15u\\) Gold, 4-40 Threaded Boardlock with 4-40 Front Screwlock Installed
Tech specs    

Official Product Page

    1511175070

Molex Electronics Ltd.
Part No. 1511175070
Description    2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Vertical, 2.00μm Tin (Sn) Plating

File Size 46.99K  /  2 Page

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Amphenol Communications Solutions

Part No. 10151114-002TLF
Description PCIe MXM Connectors, Storage and Server Connector, Right Angle, SMT, P=0.5mm, Stack Height = 5.0mm, 15u\\ Gold Plating
Tech specs    

Official Product Page

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