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  44067-2403 Datasheet PDF File

For 44067-2403 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    44067-0603 0440670603

Molex Electronics Ltd.
Part No. 44067-0603 0440670603
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")

File Size 204.16K  /  3 Page

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Coilcraft Inc

Part No. PCV-0-224-03L
Description General Purpose Inductor, 220uH, 10%, 1 Element, Ferrite-Core, ROHS COMPLIANT
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    MOLEX INC
Part No. 0440671401
Description 14 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

File Size 29.77K  /  2 Page

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Renesas Electronics Corporation

Part No. R1EX24032ATAS0I#S0
Description Two-wire serial interface 32k EEPROM (4-kword × 8-bit)
Tech specs    

Official Product Page

    MOLEX INC
Part No. 0440670403
Description 4 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

File Size 29.79K  /  2 Page

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Renesas Electronics Corporation

Part No. R1EX24032ASAS0G#U0
Description EEPROM, SOP, /Embossed Tape
Tech specs    

Official Product Page

    44067-0601 0440670601

Molex Electronics Ltd.
Part No. 44067-0601 0440670601
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 6 Circuits, Tin (Sn) Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating

File Size 204.10K  /  3 Page

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Renesas Electronics Corporation

Part No. R1EX24032ATAS0A#S0
Description EEPROM, TSSOP, /
Tech specs    

Official Product Page

    44067-0403 0440670403

Molex Electronics Ltd.
Part No. 44067-0403 0440670403
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selectiv

File Size 204.16K  /  3 Page

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Renesas Electronics Corporation

Part No. 2SD2403-T2-AZ
Description Small Signal Bipolar Transistors, POMM, /
Tech specs    

Official Product Page

    44067-0402 0440670402

Molex Electronics Ltd.
Part No. 44067-0402 0440670402
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB

File Size 204.16K  /  3 Page

View it Online

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Renesas Electronics Corporation

Part No. R1EX24032ASA00I#S0
Description EEPROM, SOP, /Embossed Tape
Tech specs    

Official Product Page

    44067-0401 0440670401

Molex Electronics Ltd.
Part No. 44067-0401 0440670401
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB

File Size 204.10K  /  3 Page

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Renesas Electronics Corporation

Part No. R1EX24032ATA00I#S0
Description EEPROM, TSSOP, /
Tech specs    

Official Product Page

    0440672402 44067-2402

Molex Electronics Ltd.
Part No. 0440672402 44067-2402
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 204.16K  /  3 Page

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Renesas Electronics Corporation

Part No. R1EX24032ASAS0I#U0
Description Two-wire serial interface 32k EEPROM (4-kword × 8-bit)
Tech specs    

Official Product Page

    44067-0201 0440670201

Molex Electronics Ltd.
Part No. 44067-0201 0440670201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")

File Size 204.09K  /  3 Page

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Renesas Electronics Corporation

Part No. R1EX24032ATAS0G#U0
Description EEPROM, TSSOP, /Embossed Tape
Tech specs    

Official Product Page

    44067-1203 0440671203

Molex Electronics Ltd.
Part No. 44067-1203 0440671203
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selecti

File Size 204.16K  /  3 Page

View it Online

Download Datasheet

For 44067-2403 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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