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Ultra Chip, Inc.
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| Part No. |
UC1602IGAD
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| OCR Text |
...e in gold bump dies Bump pitch: 55um min. Bump gap: 20uM min.
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FEATURE HIGHLIGHTS * Single chip controller-driver supports 65 COM x 102 SEG LCD.
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Version 1.1
1
ULTRACHIP
High-Voltage Mixed-Signal I... |
| Description |
Single-Chip, Ultra-Low Power 65 COM x 102 SEG Passive Matrix LCD Controller-Driver
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| File Size |
78.82K /
4 Page |
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it Online |
Download Datasheet
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Ultra Chip, Inc.
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| Part No. |
UC1605IGAB
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| OCR Text |
...e in gold bump dies Bump pitch: 55um min. Bump gap: 20uM min.
INTRODUCTION
UC1605(i) is an advanced high-voltage mixedsignal CMOS IC, especially designed for the display needs of ultra-low power hand-held devices. This chip employs Ultr... |
| Description |
Single-Chip, Ultra-Low Power 80 COM x 128 SEG Matrix Passive LCD Controller-Driver
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| File Size |
79.13K /
3 Page |
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it Online |
Download Datasheet |
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BCD SEMICONDUCTOR MANUFACTURING LTD
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| Part No. |
A42
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| OCR Text |
...l au as scribe line width 55um wafer size 6 inch electrical characteristics( ta=25 ) characteristic symbol test condition min max unit collector cutoff current i cbo v cb =200v, i e =0 0.25 ua emitter cutoff current i ... |
| Description |
300 V, NPN, Si, SMALL SIGNAL TRANSISTOR
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| File Size |
163.11K /
1 Page |
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it Online |
Download Datasheet |
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