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Amphenol Communications Solutions |
Part No. |
10114831-10114LF
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Description |
1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10114829-10114LF
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Description |
1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10114828-10114LF
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Description |
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 14 Positions
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10114830-10114LF
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Description |
1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10114868-T0J-20DLF
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Description |
XCede® High Speed Backplane Connectors, Right polarized guide header module with key.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77315-401-14LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 14 Positions 2.54 mm (0.100in) Pitch, Right Angle
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10114868-00J-20DLF
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Description |
XCede® High Speed Backplane Connectors, 2 wall header.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10114868-10J-20DLF
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Description |
XCede® High Speed Backplane Connectors, 4 wall header.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
71764-0020
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Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, Tin (Sn) Plating 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, Tin (Sn) Plating
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File Size |
121.14K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10072354-F01-14ULF
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Description |
Minitek®, Wire to Board Connectors, Shrouded Header - Through Mount Pin-in-Paste - Double row - 14 Positions - 2mm (0.079inch) - Right Angle
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
71764-0018
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Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, Tin (Sn) Plating 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, Tin (Sn) Plating
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File Size |
120.83K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10114826-00011LF
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Description |
1.25mm Wire to Board Housing, 11 Positions
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Tech specs |
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Official Product Page
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Price and Availability
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