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Amphenol Communications Solutions |
Part No. |
10155550-B103KLF
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Description |
Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Right angle, 3 position, Tin (Preplated)
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Tech specs |
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Official Product Page
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Yageo, Corp. Samsung Semiconductor Co., Ltd.
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Part No. |
CL10B473KO85PNC CL10B473KO85PNO CL10B474KO84PNC CL10B474KO84PNO CL10C120JB81PNO CL10B683KA85PND CL10B683KB85PND CL10B683KO85PND CL10C120JC81PNO CL10C120JC81PNC CL10B103KB85PNC CL10B103KB85PNO
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Description |
CAPACITOR, CERAMIC, MULTILAYER, 16 V, X7R, 0.047 uF, SURFACE MOUNT, 0603 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, X7R, 0.47 uF, SURFACE MOUNT, 0603 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.000012 uF, SURFACE MOUNT, 0603 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 25 V, X7R, 0.068 uF, SURFACE MOUNT, 0603 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.068 uF, SURFACE MOUNT, 0603 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 16 V, X7R, 0.068 uF, SURFACE MOUNT, 0603 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 100 V, C0G, 0.000012 uF, SURFACE MOUNT, 0603 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.01 uF, SURFACE MOUNT, 0603 CHIP, ROHS COMPLIANT
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File Size |
926.62K /
16 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
10155500-B103KLF
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Description |
Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Right angle, 3 Position, STG, Top Latch, Tin (preplated); B Coding<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
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Tech specs |
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Official Product Page
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Samsung Semiconductor Co., Ltd. Union Technologies, Corp.
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Part No. |
CL10F224ZB8NNNC CL05F103ZB5NNNC CL05F103ZB5NNNO CL05B104KP5NNNC CL10B683KA8NNNC CL10B683KB8NNNO CL05B104KQ5NNND CL10C120JB8NNNC CL05B104KP5NNNO CL10B683KA8NNNO CL05B104KO5NNND CL10C120JB8NNNL CL10B683KB8NNND CL10B683KA8NNND CL21F225ZOFNNNE CL10B103KB8NNNO CL10B103KB8NNND CL10B103KB8NNNC
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Description |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, Y5V, 0.22 uF, SURFACE MOUNT, 0603 CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, Y5V, 0.01 uF, SURFACE MOUNT, 0402 CHIP CAPACITOR, CERAMIC, MULTILAYER, 10 V, X7R, 0.1 uF, SURFACE MOUNT, 0402 CHIP CAPACITOR, CERAMIC, MULTILAYER, 25 V, X7R, 0.068 uF, SURFACE MOUNT, 0603 CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.068 uF, SURFACE MOUNT, 0603 CHIP CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X7R, 0.1 uF, SURFACE MOUNT, 0402 CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.000012 uF, SURFACE MOUNT, 0603 CHIP CAPACITOR, CERAMIC, MULTILAYER, 16 V, X7R, 0.1 uF, SURFACE MOUNT, 0402 CHIP CAPACITOR, CERAMIC, MULTILAYER, 16 V, Y5V, 2.2 uF, SURFACE MOUNT, 0805 CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.01 uF, SURFACE MOUNT, 0603 CHIP
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File Size |
894.55K /
17 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
10155502-B103KLF
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Description |
Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Vertical, 3 Position, STG, Top Latch, Tin (preplated); B Coding<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10155552-B103KLF
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Description |
Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Header Vertical, Tin (preplated)
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
Part: B1031 |
Maker: HITACHI(日立) |
Pack: TO-3P |
Stock: 70 |
Unit price
for : |
50: $0.78 |
100: $0.74 |
1000:
$0.70 |
Email: oulindz@gmail.com |
Contact us |
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