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bumps Datasheet PDF File

For bumps Found Datasheets File :: 2268 Search Time::1.063ms
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				PHILIPS[Philips Semiconductors]
Part No.	PCF8576 PCF8576T PCF8576U PCF8576U_10 PCF8576U_2 PCF8576U_5 PCF8576U_7 7 PCF8576U_12
OCR Text	... FFC FFC chip in tray chip with bumps in tray unsawn wafer chip with bumps on tape chip on film frame carrier (FFC) chip with bumps on film frame carrier (FFC) DESCRIPTION plastic very small outline package; 56 leads VERSION SOT190-1 - - - ...
Description	32 kHz watch circuits with adaptive motor pulse Universal LCD driver for low multiplex rates
File Size	243.10K / 40 Page	View it Online	Download Datasheet

				ams AG austriamicrosystems AG
Part No.	AS1301A-BWLT AS1301A-BTDT AS1301
OCR Text	...(3x3x0.8mm) 10-pin and WL-CSP 8-bumps packages. 2 Key Features ! ! ! ! ! ! ! ! ! ! ! ! Up to 92% Efficiency 2.7 to 5.25V Input Voltage Regulated 5V Output Automatic Mode Up-Switching <5A Shutdown Current 5V Tolerant Enable Signal Up ...
Description	5V/50mA Low Noise Inductorless Boost Converter
File Size	925.48K / 16 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V.
Part No.	IP4364CX8 IP4064CX8LF IP4064CX8/LF/P135 IP4364CX8/LF135 IP4364CX8/LF/P135
OCR Text	...afer level chip-size package; 8 bumps; 1.41 x 1.41 x 0.7 mm wafer level chip-size package; 8 bumps; 1.16 x 1.16 x 0.66 mm Version IP4064CX8/LF IP4364CX8/LF Type number IP4064CX8LF_IP4364CX8LF_1 (c) NXP B.V. 2007. All rights reserved. ...
Description	Integrated SIM card passive filter array with ESD protection to IEC61000-4-2, level 4
File Size	73.70K / 13 Page	View it Online	Download Datasheet

				ETC List of Unclassifed Manufacturers
Part No.	D3406-0000PR D3406-0000S D3406-0000SC D3406-0100PR D3406-0100S D3406-0100SC D3508-0000PR D3508-0000S D3508-0000SC D3508-0100PR D3508-0100S D3508-0100SC 3563-3000 3563-3002 D3460-0000PR D3460-0000S D3460-0000SC D3460-0100PR D3460-0100S D3460-0100SC 3460-0000PR 3460-0000S 3460-0000SC 3460-0100PR 3460-0100S 3460-0100SC 3508-0100PR 3508-0100S 3508-0100SC 3416-3000 3416-3002 3406-3000 3406-3002 D3416-0000PR 3416-0000PR D3416-0000S 3416-0000S D3416-0000SC 3416-0000SC D3416-0100SC D3416-0100PR 3406-0000PR 3406-0000S 3406-0000SC 3508-0000PR 3508-0000S 3508-0000SC
OCR Text	... connectors don't have standoff bumps. 3.8 0.3mm * Lower side from the bottom of the standoff bumps (Height: 0.6mm). 3.9 0.3mm * Lower side from the bottom of the standoff bumps (Height: 0.5mm). 0.46 0.05mm x 0.36 0.05mm LEAD SECTION ...
Description	designed for IDC (Insulation Displacement Connector) connection with 1.27mm pitch flat cable
File Size	274.64K / 9 Page	View it Online	Download Datasheet

				California Micro Devices Corporation
Part No.	CM1405-03CS CM1405-03CP CM1405-01CP CM1405-01CS
OCR Text	...g (see note 2) BOTTOM VIEW (bumps Up View) 8 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 (bumps Down View) 1 A B C 2 3 4 5 6 7 C1 C2 GND C3 GND C4 B2 C5 GND C6 B3 C7 GND C8 B4 N051 ...
Description	8 Channel LCD EMI Filter Array with ESD protection and Optiguard™ Coating
File Size	947.66K / 11 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	CM1402-03CP
OCR Text	... information lead-free finish bumps package ordering part number 1 part marking 10 csp cm1402-03cp ce note 1: parts are shipped in tape and reel form unless otherwise specified. specifications absolute maximum ratings p...
Description	SIM Card EMI Filter Array with ESD Protection
File Size	411.72K / 12 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	EMIF10-COM01C2
OCR Text	... Lead free coated Flip-Chip (25 bumps) Description The EMIF10-COM01C2 is a highly integrated device designed to suppress EMI / RFI noise in all systems subjected to electromagnetic interferences. The EMIF10 Flip-Chip packaging means the...
Description	EMI Filter including ESD protection
File Size	177.76K / 7 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	EMIF10-COM01F208 EMIF10-COM01F2
OCR Text	...gration Figure 1. Flip Chip (25 bumps) Pin configuration (bump side) 5 I5 Complies with the following standard: IEC 61000-4-2 level 4 - 15 kV (air discharge) - 8 kV (contact discharge) 4 I4 3 I3 2 I2 1 I1 A B C ...
Description	10-line IPAD, EMI filter including ESD protection
File Size	166.58K / 7 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	EMIF10-LCD03F3
OCR Text	... 0.6mm thickness Flip Chip (24 bumps) Description The EMIF10-LCD03F3 is a 10-line highly integrated LC filter designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF10 Flip Chip pa...
Description	10-line IPAD, EMI filter and ESD protection
File Size	312.30K / 7 Page	View it Online	Download Datasheet

				CALMIRCO[California Micro Devices Corp]
Part No.	CSPRC032AG CSPRC032A
OCR Text	...mm pitch 0.30mm Eutectic solder bumps Ultra small footprint suitable for portable devices Lead-free version available Product Description The CSPRC032A is a 4-channel low pass EMI filter (RC-R configuration) in a Chip Scale Package (CSP...
Description	4 Channel EMI Filter Network
File Size	200.81K / 5 Page	View it Online	Download Datasheet

For bumps Found Datasheets File :: 2268 Search Time::1.063ms
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